Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines 29
Thermal/Mechanical Reference Design
If other custom heatsinks are intended for use with the Dual-Core Intel Xeon processor 2.80 GHz,
they must support the following interface control requirements to be compatible with the reference
mechanical components:
• Requirement 1: Heatsink assembly must stay within the volumetric keep-in.
• Requirement 2: Maximum mass and center of gravity.
Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of gravity
38.1 mm [1.5 in.] above the bottom of the heatsink base.
• Requirement 3: Maximum and minimum compressive load.
Any custom thermal solution design should meet the loading specification as documented within
this document, and should refer to the datasheet for specific details on package loading
specifications.
Figure 2-9. 2U+ CEK Heatsink Thermal Performance
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0 102030405060708090100
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
∆
P, inch water
Mean
Ψ
ca
= 0.1435 + 1.2225*CFM
-0.9397
σ
= 0.008 C/W
∆
P = 5.52e-05CFM
2
+ 5.24e-03CFM
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0 102030405060708090100
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
∆
P, inch water
Mean
Ψ
ca
= 0.1435 + 1.2225*CFM
-0.9397
σ
= 0.008 C/W
∆
P = 5.52e-05CFM
2
+ 5.24e-03CFM