Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines 31
Thermal/Mechanical Reference Design
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the
Dual-Core Intel Xeon processor 2.80 GHz. From Table 2-2 the three-sigma (mean+3sigma)
performance of the thermal solution is computed to be 0.290 °C/W and the processor local ambient
temperature (T
LA
) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this
thermal solution is calculated as:
Equation 2-9. y = 0.290x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-12 below shows the comparison of this reference thermal solution’s Thermal Profile to the
Dual-Core Intel Xeon processor 2.80 GHz Thermal Profile B specification. The 1U CEK solution
meets the Thermal Profile B with a 0.3°C margin at the lower end (Pcontrol_base_B) and a 0 °C
margin at the upper end (TDP). However, as explained in Section 2.2.3, designing to Thermal
Profile B results in increased TCC activation and measurable performance loss for the processor. In
this case, it is estimated that up to 5% of all the processors in a population that utilizes the 1U CEK
reference solution may see TCC activation that results in a measurable performance loss of >1.5%
when running an application that consumes power equivalent to TDP.
Figure 2-11. 2U+ CEK Thermal Adherence to Dual-Core Intel Xeon Processor 2.80 GHz
Thermal Profile A
0
10
20
30
40
50
60
70
80
90
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Power [W]
Tcase [°C]
T
CASE MAX_B
@
TDP
T
CASE MAX_B
@
P
CONTROL_BASE
P
CONTROL_BASE
TDP
2U+ CEK Reference Solution
y=0.234*x+40
Thermal Profile A
y=0.211*x+43.1
0
10
20
30
40
50
60
70
80
90
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Power [W]
Tcase [°C]
T
CASE MAX_B
@
TDP
T
CASE MAX_B
@
P
CONTROL_BASE
P
CONTROL_BASE
TDP
2U+ CEK Reference Solution
y=0.234*x+40
Thermal Profile A
y=0.211*x+43.1