Intel Xeon processor LV Thermal Design Guide

Reference Thermal Solutions
Dual-Core Intel
®
Xeon
®
processor LV and ULV
Thermal Design Guide August 2006
28 Reference Number: 311374-002
6.4.2 Keep-Out Zone Requirements
The keep-out zone requirements on the PCB to use this heatsink are detailed in
Appendix B, “Mechanical Drawings”. It is critical for the board designer to allocate
space on the board for the heatsink since it extends beyond the footprint of the socket.
6.4.3 Thermal Performance
The 1U reference heatsink should be made from copper to achieve the necessary
thermal performance. Based on the boundary conditions stated (T ambient = 40 °C),
the heatsink will meet the thermal performance needed to cool both the 15 W and 31 W
processor in the 1U form factor. The heatsink performance versus volumetric airflow
rate is shown in Figure 17.
The system integrator can make trade-offs to determine the best heatsink material to
use based on usage conditions. For example, a higher ambient temperature might be
considered with use of the copper heatsink.
Figure 16. 1U Reference Heatsink Assembly