Intel Xeon processor LV Thermal Design Guide

Introduction
Dual-Core Intel
®
Xeon
®
processor LV and ULV
Thermal Design Guide August 2006
6 Reference Number: 311374-002
1.0 Introduction
The power dissipation of electronic components has risen along with the increase in
complexity of computer systems. To ensure quality, reliability, and performance goals
are met over the product’s life cycle, the heat generated by the device must be
properly dissipated. Typical methods to improve heat dissipation include selective use
of airflow ducting and/or the use of heatsinks.
The goals of this document are to:
• Explain the thermal and mechanical specification for the Dual-Core Intel
®
Xeon
®
processor LV and ULV.
• Describe a reference thermal solution that meets the specifications.
A properly designed thermal solution adequately cools the device die temperature at or
below the thermal specification. This is accomplished by providing a suitable local-
ambient temperature, ensuring adequate local airflow, and minimizing the die to local-
ambient thermal resistance. Operation outside the functional limits can degrade system
performance and may cause permanent changes in the operating characteristics of the
component.
This document describes thermal design guidelines for the processor in the micro Flip
Chip-Pin Grid Array (micro FCPGA) package. Detailed mechanical and thermal
specifications for these processors can be found in the Dual-Core Intel
®
Xeon
®
processor LV and ULV Datasheet.
The information provided in this document is for reference only and additional
validation must be performed prior to implementing the designs into final production.
The intent of this document is to assist each original equipment manufacturer (OEM)
with the development of thermal solutions for their individual designs. The final
heatsink solution, including the heatsink, attachment method, and thermal interface
material (TIM) must comply with the mechanical design, environmental, and reliability
requirements delineated in the processor datasheet. It is the responsibility of each OEM
to validate the thermal solution design with their specific applications.
This document addresses thermal and mechanical design specifications for the Dual-
Core Intel
®
Xeon
®
processor LV and ULV only. For thermal design information on other
Intel
®
components, refer to the respective component datasheet.
Note: Unless otherwise specified, the term “processor” refers to the Dual-Core Intel
®
Xeon
®
processor LV and ULV.
1.1 Design Flow
Several tools are available from Intel Corporation to assist in the development of a
reliable, cost-effective thermal solution. Figure 1 illustrates a typical thermal solution
design process with available tools noted. The tools are available through your local
Intel Corporation field sales representative.