Intel Pentium M Processor on 90nm Process with 2-MB L2 Cache Datasheet

50 Datasheet
Package Mechanical Specifications and Pin Information
NOTE: Overall height with socket is based on design dimensions of the Micro-FCPGA package with no thermal
solution attached. Values are based on design specifications and tolerances. This dimension is subject
to change based on socket design, OEM motherboard design or OEM SMT process.
Table 4-1. Micro-FCPGA Package Dimensions
Symbol Parameter Min Max Unit
A Overall height, top of die to package seating plane 1.88 2.02 mm
– Overall height, top of die to PCB surface, including
socket (Refer to Note 1)
4.74 5.16 mm
A1 Pin length 1.95 2.11 mm
A2 Die height 0.820 mm
A3 Pin-side capacitor height – 1.25 mm
B Pin diameter 0.28 0.36 mm
D Package substrate length 34.9 35.1 mm
E Package substrate width 34.9 35.1 mm
D1 Die length 12.54 mm
E1 Die width 6.99 mm
e Pin Pitch 1.27 mm
K Package edge keep-out 5 mm
K1 Package corner keep-out 7 mm
K3 Pin-side capacitor boundary 14 mm
N Pin count 478 each
Pdie Allowable pressure on the die for thermal solution – 689 kPa
W Package weight 4.5 g
Package Surface Flatness
0.286 mm