Datasheet
Intel
®
Celeron
®
Processor up to 1.10 GHz
4 Datasheet
3.4.5 Reading Overshoot/Undershoot Specification Tables
(FC-PGA/FC-PGA2 Packages)..............................................................61
3.4.6 Determining if a System meets the Overshoot/Undershoot
Specifications (FC-PGA/FC-PGA2 Packages)....................................... 62
3.5 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines...........64
4.0 Thermal Specifications and Design Considerations.........................................................65
4.1 Thermal Specifications........................................................................................65
4.1.1 Thermal Diode........................................................................................ 68
5.0 Mechanical Specifications................................................................................................69
5.1 S.E.P. Package ...................................................................................................69
5.1.1 Materials Information..............................................................................69
5.1.2 Signal Listing (S.E.P. Package) ............................................................70
5.2 PPGA Package ...................................................................................................79
5.2.1 PPGA Package Materials Information....................................................79
5.2.2 PPGA Package Signal Listing................................................................81
5.3 FC-PGA/FC-PGA2 Packages .............................................................................92
5.3.1 FC-PGA Mechanical Specifications .......................................................92
5.3.2 Mechanical Specifications (FC-PGA2 Package)....................................94
5.3.2.1 Recommended Mechanical Keep-Out Zones
(FC-PGA2 Package) .................................................................96
5.3.3 FC-PGA/FC-PGA2 Package Signal List.................................................97
5.4 Processor Markings (PPGA/FC-PGA/FC-PGA2 Packages).............................108
5.5 Heatsink Volumetric Keepout Zone Guidelines.................................................109
6.0 Boxed Processor Specifications..................................................................................... 110
6.1 Mechanical Specifications for the Boxed Intel
®
Celeron
®
Processor................ 110
6.1.1 Mechanical Specifications for the S.E.P. Package...............................110
6.1.1.1 Boxed Processor Heatsink Weight..........................................112
6.1.1.2 Boxed Processor Retention Mechanism .................................112
6.1.2 Mechanical Specifications for the PPGA Package...............................113
6.1.2.1 Boxed Processor Heatsink Weight..........................................114
6.1.3 Mechanical Specifications for the FC-PGA/FC-PGA2 Packages.........114
6.1.3.1 Boxed Processor Heatsink Weight..........................................115
6.2 Thermal Specifications......................................................................................115
6.2.1 Thermal Requirements for the Boxed Intel
®
Celeron
®
Processor........115
6.2.1.1 Boxed Processor Cooling Requirements ................................115
6.2.1.2 Boxed Processor Thermal Cooling Solution Clip .................... 117
6.3 Electrical Requirements for the Boxed Intel
®
Celeron
®
Processor ...................117
6.3.1 Electrical Requirements .......................................................................117
7.0 Processor Signal Description.........................................................................................120
7.1 Signal Summaries .............................................................................................126