Datasheet

TABLE OF CONTENTS
3
5.1.3 STOP-GRANT STATE — STATE 3......................................................................... 42
5.1.4 HALT/GRANT SNOOP STATE — STATE 4 ........................................................... 42
5.1.5 SLEEP STATE — STATE 5..................................................................................... 43
5.1.6 CLOCK CONTROL .................................................................................................. 43
5.2 SYSTEM MANAGEMENT BUS (SMBUS) INTERFACE ........................................................... 43
5.2.1 PROCESSOR INFORMATION ROM....................................................................... 44
5.2.2 SCRATCH EEPROM ............................................................................................... 48
5.2.3 PROCESSOR INFORMATION ROM AND SCRATCH EEPROM SUPPORTED
SMBUS TRANSACTIONS ....................................................................................................... 48
5.2.4 THERMAL SENSOR................................................................................................ 49
5.2.5 THERMAL SENSOR SUPPORTED SMBUS TRANSACTIONS .............................50
5.2.6 THERMAL SENSOR REGISTERS..........................................................................51
5.2.7 SMBus Device Addressing....................................................................................... 53
6. THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS......................................... 55
6.1 THERMAL SPECIFICATIONS ..............................................................................................55
6.1.1 POWER DISSIPATION............................................................................................55
6.1.2 PLATE FLATNESS SPECIFICATION...................................................................... 57
6.2 PROCESSOR THERMAL ANALYSIS .................................................................................... 57
6.2.1 THERMAL SOLUTION PERFORMANCE ............................................................... 57
6.2.2 THERMAL PLATE TO HEAT SINK INTERFACE MANAGEMENT GUIDE............. 58
6.2.3 MEASUREMENTS FOR THERMAL SPECIFICATIONS.........................................58
7. MECHANICAL SPECIFICATIONS ........................................................................................... 60
7.1 WEIGHT .................................................................................................................................. 64
7.2 CARTRIDGE TO CONNECTOR MATING DETAILS.......................................................................... 64
7.3 SUBSTRATE EDGE FINGER SIGNAL LISTING ............................................................................. 66
8. INTEGRATION TOOLS.............................................................................................................76
8.1 IN-TARGET PROBE (ITP).......................................................................................................... 76
8.1.1 PRIMARY FUNCTION .................................................................................................... 76
8.1.2 DEBUG PORT CONNECTOR DESCRIPTION .............................................................. 76
8.1.3 KEEP OUT CONCERNS ................................................................................................ 77
8.1.4 ADDITIONAL INTEGRATION TOOL MECHANICAL KEEP OUTS................................ 77
8.1.5 DEBUG PORT SIGNAL DESCRIPTIONS ...................................................................... 77
8.1.6 DEBUG PORT SIGNAL NOTES..................................................................................... 80
8.1.7 Using the TAP to Communicate to the processor........................................................... 82
8.2 LOGIC ANALYZER INTERCONNECT (LAI) AND TRACE CAPTURE TOOL CONSIDERATIONS.............. 82
8.2.1 LAI and Trace Capture Tool System Design Considerations ......................................... 82
8.2.2 LAI and Trace Capture tool Mechanical Keep Outs ....................................................... 82
9. BOXED PROCESSOR SPECIFICATIONS...............................................................................83
9.1 INTRODUCTION ........................................................................................................................83
9.2 MECHANICAL SPECIFICATIONS ................................................................................................. 83
9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS ........................................................ 85
9.2.2 BOXED PROCESSOR HEATSINK WEIGHT.................................................................85
9.2.3 BOXED PROCESSOR RETENTION MECHANISM ...................................................... 85
9.3 THERMAL SPECIFICATIONS....................................................................................................... 86
9.3.1 Boxed Processor Cooling Requirements........................................................................ 86
9.3.2 Boxed Processor Passive Heatsink Performance .......................................................... 86
9.3.2 Optional auxiliary fan attachment.................................................................................... 87
10. APPENDIX...............................................................................................................................90