LGA1150 Socket Application Guide September 2013 Order No.
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Contents—LGA1150 Socket Contents Revision History..................................................................................................................6 1.0 Introduction................................................................................................................. 7 1.1 Related Documents.................................................................................................7 1.2 Definition of Terms.......................................................................
LGA1150 Socket—Figures Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 LGA1150 Pick and Place Cover.................................................................................... 9 LGA1150 Socket Land Pattern................................................................................... 10 Attachment to Motherboard...................................................................................... 11 Pick and Place Cover...................................................................
Tables—LGA1150 Socket Tables 1 2 3 4 5 6 7 8 9 10 11 Related Documents ...................................................................................................7 Terms and Descriptions.............................................................................................. 7 Socket Component Mass...........................................................................................24 1150-land Package and LGA1150 Socket Stackup Height..............................................
LGA1150 Socket—Revision History Revision History Revision Number 001 002 LGA1150 Socket Application Guide 6 Description • • Initial release Added Desktop Revision Date June 2013 Intel® Pentium processor family September 2013 September 2013 Order No.
Introduction—LGA1150 Socket 1.0 Introduction This document covers the LGA1150 socket for Desktop systems using the Desktop 4th Generation Intel® Core™ processor family, Desktop Intel® Pentium® processor family, and for UP Server / Workstation systems using the Intel® Xeon® processor E3-1200 v3 product family. The information in this document include: 1.
LGA1150 Socket—Introduction Term LGA1150 Socket Application Guide 8 Description FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. ILM Independent Loading Mechanism provides the force needed to seat the LGA1150 land package onto the socket contacts.
LGA1150 Socket—LGA1150 Socket 2.0 LGA1150 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1150 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The contacts are arranged in two opposing L-shaped patterns within the grid array.
LGA1150 Socket—LGA1150 Socket Figure 2. LGA1150 Socket Land Pattern 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1150 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 1 on page 9, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. LGA1150 Socket Application Guide 10 September 2013 Order No.
LGA1150 Socket—LGA1150 Socket Figure 3. Attachment to Motherboard 2.3 Socket Components The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Socket Mechanical Drawings for detailed drawings. Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework profiles.
LGA1150 Socket—LGA1150 Socket • Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste. • Solder ball diameter 0.6 mm ± 0.02 mm, before attaching to the socket lead. The co-planarity (profile) and true position requirements are defined in Socket Mechanical Drawings.
LGA1150 Socket—LGA1150 Socket Figure 4. Pick and Place Cover 2.4 Package Installation / Removal As indicated in Figure 5 on page 14, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin 1 triangle and the socket Pin 1 chamfer provide visual reference for proper orientation. • The package substrate has orientation notches along two opposing edges of the package, offset from the centerline.
LGA1150 Socket—LGA1150 Socket Figure 5. Package Installation / Removal Features Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Socket Mechanical Drawings. Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Package / Socket Stackup Height on page 24 for the calculated IHS height above the motherboard. 2.
LGA1150 Socket—LGA1150 Socket 2.7 Component Insertion Forces Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket. 2.8 Socket Size Socket information needed for motherboard design is given in Appendix C.
LGA1150 Socket—Independent Loading Mechanism (ILM) 3.0 Independent Loading Mechanism (ILM) The ILM has two critical functions – deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints. The mechanical design of the ILM is integral to the overall functionality of the LGA1150 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system.
Independent Loading Mechanism (ILM)—LGA1150 Socket The ILM assembly design ensures that, once assembled to the back plate, the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm. When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 6 on page 17.
LGA1150 Socket—Independent Loading Mechanism (ILM) • Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”. Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and ILM back plate are removed prior to rework. The ILM back plate should also be removed when reworking through hole mounted components in a mini-wave or solder pot). The maximum temperature for the pre-applied insulator on the ILM is approximately 106 °C. Figure 7.
Independent Loading Mechanism (ILM)—LGA1150 Socket Figure 8. Shoulder Screw 3.2 Assembly of Independent Loading Mechanism (ILM) to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. See Figure 9 on page 20 for step by step assembly sequence. 1. Place the back plate in a fixture. The motherboard is aligned with the fixture. 2. Install the shoulder screw in the single hole near Pin 1 of the socket.
LGA1150 Socket—Independent Loading Mechanism (ILM) Figure 9. Independent Loading Mechanism (ILM) Assembly As indicated in Figure 10 on page 20, the shoulder screw, socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket. The result is a specific Pin 1 orientation with respect to ILM lever. Figure 10. LGA1150 Socket Application Guide 20 Pin1 and Independent Loading Mechanism (ILM) Lever September 2013 Order No.
Independent Loading Mechanism (ILM)—LGA1150 Socket 3.3 Independent Loading Mechanism (ILM) Interchangeability ILM assembly and ILM back plate built from the Intel controlled drawings are intended to be interchangeable. Interchangeability is defined as an ILM from Vendor A will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A, B or C. ILM assembly and ILM back plate from all vendors are also interchangeable.
LGA1150 Socket—Independent Loading Mechanism (ILM) • The ILM cover for the LGA115x socket will have a flammability rating of V-2 per UL 60950-1. Note: The ILM Cover pop off feature is not supported if the ILM Covers are interchanged on different vendor’s ILMs. Figure 11. Independent Loading Mechanism (ILM) Cover As indicated in Figure 11 on page 22, the pick and place cover should remain installed during ILM assembly to the motherboard.
Independent Loading Mechanism (ILM)—LGA1150 Socket Figure 12. ILM Cover and PnP Cover Interference As indicated in Figure 12 on page 23, the pick and place cover cannot remain in place and used in conjunction with the ILM Cover. The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place. The ILM cover will also interfere and pop off if the ILM is closed with a processor in place in the socket. September 2013 Order No.
LGA1150 Socket—LGA1150 Socket and ILM Specifications 4.0 LGA1150 Socket and ILM Specifications This chapter describes the following specifications and requirements: 4.1 • Mechanical Specifications on page 24 • Electrical Requirements on page 25 • Environmental Requirements on page 26 Mechanical Specifications Component Mass Table 3.
LGA1150 Socket and ILM Specifications—LGA1150 Socket Table 5 on page 25 provides load specifications for the LGA1150 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions. Table 5.
LGA1150 Socket—LGA1150 Socket and ILM Specifications Table 6. Electrical Requirements for LGA1150 Socket Parameter Value Comment <3.6nH The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket.
LGA1150 Socket and ILM Specifications—LGA1150 Socket Figure 13. Flow Chart of Knowledge-Based Reliability Evaluation Methodology A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. September 2013 Order No.
LGA1150 Socket—Component Suppliers Appendix A Component Suppliers Note: The part numbers listed below identifies the reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices.
Mechanical Drawings—LGA1150 Socket Appendix B Mechanical Drawings The following table lists the mechanical drawings included in this appendix. Table 9.
LGA1150 Socket—Mechanical Drawings Figure 14. LGA1150 Socket Application Guide 30 Socket/Heatsink / ILM Keep-out Zone Primary Side (Top) September 2013 Order No.
Mechanical Drawings—LGA1150 Socket Figure 15. Socket / Heatsink / ILM Keep-out Zone Secondary Side (Bottom) September 2013 Order No.
LGA1150 Socket—Mechanical Drawings Figure 16. LGA1150 Socket Application Guide 32 Socket / Processor / ILM Keep-out Zone Primary Side (Top) September 2013 Order No.
Mechanical Drawings—LGA1150 Socket Figure 17. Socket / Processor / ILM Keep-out Zone Secondary Side (Bottom) September 2013 Order No.
LGA1150 Socket—Heatsink Back Plate Drawings Appendix C Heatsink Back Plate Drawings This heatsink back plate design is intended to adapt as a reference for OEMs that use threaded fasteners on customized thermal solution, to comply with the mechanical and structural requirements for the LGA115x socket. The heatsink back plate does not have to provide additional load for socket solder joint protect.
Heatsink Back Plate Drawings—LGA1150 Socket Figure 18. Heatsink Back Plate Keep-in Zone September 2013 Order No.
LGA1150 Socket—Heatsink Back Plate Drawings Figure 19. LGA1150 Socket Application Guide 36 Heatsink Back Plate September 2013 Order No.
