Mobile Intel® 915GME Express Chipset Development Kit User’s Manual April 2007 Order Number: 317230-001US
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Contents—Mobile Intel® 915GME Express Chipset Contents 1.0 About This Manual ..................................................................................................... 7 1.1 Content Overview................................................................................................ 7 1.2 Text Conventions ................................................................................................ 7 1.3 Glossary of Terms and Acronyms........................................................
Mobile Intel® 915GME Express Chipset —Contents 3.5 3.6 3.7 Clock Generation ...............................................................................................28 Power Management States ..................................................................................28 3.6.1 Transition to S1 or S3 .............................................................................29 3.6.2 Transition to S4......................................................................................29 3.6.
Contents—Mobile Intel® 915GME Express Chipset Figures 1 2 3 4 5 6 7 8 Mobile Intel® 915GME Express Chipset Block Diagram ................................................. 21 Mobile Intel® 915GME Express Chipset Component Locations........................................ 34 Back Panel Connector Locations ................................................................................. 36 Configuration Jumper and Switch Locations .................................................................
Mobile Intel® 915GME Express Chipset —Contents Revision History Date April 2007 Revision 001 Mobile Intel® 915GME Express Chipset Development Kit User’s Manual 6 Description Initial release of the document April 2007 Order Number: 317230-001US
About This Manual—Mobile Intel® 915GME Express Chipset 1.0 About This Manual This user’s manual describes the use of the Mobile Intel® 915GME Express Chipset Development Kit. This manual has been written for OEMs, system evaluators, and embedded system developers. This document defines all jumpers, headers, LED functions, and their locations on the board, along with subsystem features and POST codes.
Mobile Intel® 915GME Express Chipset —About This Manual added to numbers that begin with A through F. (For example, FF is shown as 0FFH.) Decimal and binary numbers are represented by their customary notations. (That is, 255 is a decimal number and 1111 1111 is a binary number. In some cases, the letter B is added for clarity.
About This Manual—Mobile Intel® 915GME Express Chipset 1.3 Glossary of Terms and Acronyms This section defines conventions and terminology used throughout this document. ADD2 ADD2 is an acronym for Advanced Digital Display, 2nd Generation. ADD2 video interfaces come in two configurations: Normal and Reversed. The normal is often referred to as ADD2 or ADD2-N and the reversed is referred to as ADD2-R. The 915GM platform can only support the ADD2-R video interface.
Mobile Intel® 915GME Express Chipset —About This Manual needed to ensure the setup time of the receiver. More precisely, flight time is defined as: • The time difference between a signal at the input pin of a receiving agent crossing the switching voltage (adjusted to meet the receiver manufacturer’s conditions required for AC timing specifications; i.e., ringback, etc.
About This Manual—Mobile Intel® 915GME Express Chipset System Bus The System Bus is the microprocessor bus of the processor. Setup Window The time between the beginning of Setup to Clock (TSU_MIN) and the arrival of a valid clock edge. This window may be different for each type of bus agent in the system.
Mobile Intel® 915GME Express Chipset —About This Manual Table 1. Acronyms (Sheet 2 of 2) Acronym Definition LS Low-speed. Refers to USB MC Modem Codec PCM Pulse Code Modulation PLC Platform LAN Connect RTC Real Time Clock SATA Serial ATA SMBus System Management Bus. A two-wire interface through which various system components may communicate.
About This Manual—Mobile Intel® 915GME Express Chipset 1.6 Related Documents Table 3 provides a summary of publicly available documents related to this development kit. As supplements to the documents listed below, technical white papers detailing specific features of the Mobile Intel® 915GME Express Chipset can be found at: http://developer.intel.com/design/chipsets/915gme/index.htm For any additional documentation, please contact your Intel Representative. Table 3.
Mobile Intel® 915GME Express Chipset —Getting Started 2.0 Getting Started This chapter identifies the evaluation kit’s key components, features and specifications. It also details basic board setup and operation. 2.1 Overview The evaluation board consists of a baseboard populated with the Mobile Intel® 915GME Express Chipset , other system board components, and peripheral connectors.
Getting Started—Mobile Intel® 915GME Express Chipset • Two SATA and one IDE (40 pin) Hard Drive interface • Two PCI 2.3 compliant desktop slots • 82802AC8 Firmware Hub (FWH) • 82562EZ 10/100 Mbps Platform LAN Connect (PLC) • Two x1 PCI Express slots. Note: There are actually three x1 PCI Express slots but slot 2 was used for validation purposes. Only slots 0 and 1 are supported.
Mobile Intel® 915GME Express Chipset —Getting Started • BIOS recovery jumper • Boot Block protection jumper • Support for Serial, IrDA, serial mouse, and keyboard 2.
Getting Started—Mobile Intel® 915GME Express Chipset The following features of AMI* BIOS are enabled in the Mobile Intel® 915GME Express Chipset : • DDR2 SDRAM detection, configuration, and initialization • Mobile Intel® 915GME Express Chipset configuration • POST codes displayed to port 80h • PCI/PCI Express device enumeration and configuration • Integrated video configuration and initialization • Super I/O configuration • CPU microcode update 2.
Mobile Intel® 915GME Express Chipset —Getting Started Note: Desktop peripherals, including add-in cards, will not work in mobile power mode. If desktop peripherals are used, the platform must be powered using desktop power mode. The AC Brick power supply configuration does not provide the 12 V supply required by most desktop peripherals. Note: Select a power supply that complies with the "ATX12V" 1.1 specification. For more information, refer to http://www.formfactors.org.
Getting Started—Mobile Intel® 915GME Express Chipset Connect a PS/2-style or USB mouse and keyboard (see Figure 3 on page 36 for connector locations). Note: J1A1 (on the baseboard) is a stacked PS/2 connector. The bottom connector is for the keyboard and the top is for the mouse. 8. Connect an Ethernet cable (optional). 9. Connect the monitor through the VGA connector. 10. Connect the power supply. Connect an appropriate power supply to the evaluation board.
Mobile Intel® 915GME Express Chipset —Theory of Operation 3.0 Theory of Operation 3.1 Block Diagram Figure 1 shows the Mobile Intel® 915GME Express Chipset block diagram.
Theory of Operation—Mobile Intel® 915GME Express Chipset Mobile Intel® 915GME Express Chipset Block Diagram FSB 400/533 MHz VGA CRT Mobile Intel® 915GME Express Chipset (GMCH) CK-SSCD Clocking IMVP IV VR Dual Channel DDR2 400/533 MHz PCI Express / SDVO PCIE GFX 915GME VREG USB 2.0 7 USB Conn 1 Docking Conn PCI 2.3 x4 DMI DDR VR SO-DIMM LVDS LVDS/ ALS/BLI CK-410M Clocking XDP 5V PCI Slot 4 Intel® Pentium® M processor with 2MB L2 cache SO-DIMM Thermal Sensor 5V PCI Slot 3 Figure 1.
Mobile Intel® 915GME Express Chipset —Theory of Operation 3.3 Thermal Management The objective of thermal management is to ensure that the temperature of each component is maintained within specified functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet their specified performance requirements. Operation outside the functional limit can degrade system performance and cause reliability problems.
Theory of Operation—Mobile Intel® 915GME Express Chipset Note: Memory that utilizes 128 MBit technology is not supported by the GMCH and is not supported on the Mobile Intel® 915GME Express Chipset . Note: The SODIMM connectors are on the back side of the board. Caution: Standby voltage is applied to the SODIMM sockets when the system is in the S3 state. Therefore, do not insert or remove SODIMMs unless the system is unplugged. 3.4.1.
Mobile Intel® 915GME Express Chipset —Theory of Operation 3.4.2.3 On-Board LAN The 82562EZ provides the PHY for the Intel ICH6-M’s integrated LAN connect interface. This provides a low cost, reduced footprint solution for 10/100 Mbit LAN connectivity. The 82562EZ component is connected to the ICH6-M chipset through the LAN Connect Interface (LCI) and to an RJ45 connector at J5A1A with built in magnetic decoupling. Access to this interface is provided on the rear I/O panel (See Figure 3 on page 36).
Theory of Operation—Mobile Intel® 915GME Express Chipset 3.4.2.7 LPC Super I/O (SIO)/LPC Slot An SMSC LPC47N207 serves as the SIO on the Mobile Intel® 915GME Express Chipset platform. Shunting the jumper at J7E4 to the 2-3 positions can disable the SIO by holding it in reset. This allows other SIO solutions to be tested in the LPC slot at J8F2. A sideband header is provided at J9G2 for this purpose. This sideband header also has signals for LPC power management.
Mobile Intel® 915GME Express Chipset —Theory of Operation 3.4.3 System I/O and Connector Summary The evaluation board provides extensive I/O capability in the form of internal connectors and headers as detailed by the following list. For detailed information on these connectors and headers, please refer to “Hardware Reference” on page 34.
Theory of Operation—Mobile Intel® 915GME Express Chipset In addition to the internal I/O connections listed above, the evaluation board also contains the following I/O on the rear panel (as illustrated in Figure 3 on page 36). • Five USB ports on back panel. • VGA connector • PS/2-style keyboard and mouse ports • LAN connector • One 9-pin serial connector • One IrDA port • One SVideo connector (not functional) 3.4.3.
Mobile Intel® 915GME Express Chipset —Theory of Operation 3.4.3.6 Keyboard/Mouse The keyboard and mouse connectors are PS/2 style, six-pin stacked miniature DSUB connectors. The top connector is for the mouse and the bottom connector is for the keyboard. 3.4.3.7 32 bit/33 MHz PCI Connectors Two industry standard 32 bit/33 MHz PCI connectors are provided on the evaluation board. These slots support 3.3 V and 5 V devices. 3.4.3.
Theory of Operation—Mobile Intel® 915GME Express Chipset Table 5 lists the power management states that have been identified for the Mobile Intel® 915GME Express Chipset Platform. Table 5. Mobile Intel® 915GME Express Chipset Power Management States State 3.6.
Mobile Intel® 915GME Express Chipset —Theory of Operation For AC power loss, the system operation is defined by register settings in the Intel ICH6-M. Upon the return of power, a BIOS option, set prior to the power loss, allows the system to either go immediately to the S5 state, or reboot to the Full-On state, no matter what the state was before the power loss. External logic for this functionality is not necessary.
Theory of Operation—Mobile Intel® 915GME Express Chipset Table 6. Mobile Intel® 915GME Express Chipset Voltage Rails (Sheet 2 of 4) Voltage Groups 1.8 12.0 Switched 2.5 Switched 3.3 3.3 Always 3.3 Switched April 2007 Order Number: 317230-001US Voltage Rail Reference Designator +V1.5S_ICH_EV R6G10.1 +V1.5S_PCIE_L R6G7.2 +V1.5S_PCIE_ICH FB6G1.1 +V1.5S_ICH R7H13.2 +V1.5S_GPLL_ICH R6V13.2 +V1.5S_APLL_ICH R7H8.2 +VCCA_PROC R3C4.2 +V1.8_DDR R5B11.2 +V1.8_DIMM R5B12.2 +V1.8_LAN R5B1.
Mobile Intel® 915GME Express Chipset —Theory of Operation Table 6. Mobile Intel® 915GME Express Chipset Voltage Rails (Sheet 3 of 4) Voltage Groups 5.0 5.0 Always 5.0 Switched Mobile Intel® 915GME Express Chipset Development Kit User’s Manual 32 Voltage Rail Reference Designator +V3.3S_PEG R6C1.2 +V3.3S_ICH R8U3.2 +V3.3S_LVDSBKLT R6V3.1 +V3.3S_L R6E1.2 +V3.3S_PCI R9A6.1 +V3.3S_PCISLOT0 R7C5.2 +V3.3S_PCISLOT1 R7B20.2 +V3.3S_PCISLOT2 R8D1.2 +V3.3S_CLKRC R5G7.1 +V3.3S_CLKVDD (2.
Theory of Operation—Mobile Intel® 915GME Express Chipset Table 6. Mobile Intel® 915GME Express Chipset Voltage Rails (Sheet 4 of 4) Voltage Groups Battery Voltage Batter Voltage Always Battery Voltage Switched -12 Battery Charger April 2007 Order Number: 317230-001US Voltage Rail Reference Designator +5VS_PHASE2 (CPU Core) R3B3.2 +5VS_VTTMCH R4V1.2 +VBAT U4F2.14 +VCC_LVDSBKLT R6F9.1 VBAT_VTTVR R4G2.2 VDC_VDDQVR R5B5.1 +VBAT_MCHVR R4G1.2 +VBATA R5J1.2 +V12_ATX R5J1.
Mobile Intel® 915GME Express Chipset —Hardware Reference 4.0 Hardware Reference This section provides reference information on the hardware, including locations of evaluation board components, connector pinout information and jumper settings. Figure 2 provides an overview of basic board layout. 4.1 Primary Features Figure 2 shows the major components of the Mobile Intel® 915GME Express Chipset board and Table 7 gives a brief description of each component. Figure 2.
Hardware Reference—Mobile Intel® 915GME Express Chipset 1 Table 7.
Mobile Intel® 915GME Express Chipset —Hardware Reference 4.2 Back Panel Connectors This section describes the Mobile Intel® 915GME Express Chipset panel connectors on the Mobile Intel® 915GME Express Chipset platform. Note: Many of the connectors provide operating voltage (for example, +5 V DC and +12 V DC) to devices inside the computer chassis, such as fans and internal peripherals. Most of these connectors are not over-current protected.
Hardware Reference—Mobile Intel® 915GME Express Chipset 4.3 Configuration Settings Note: Do not move jumpers with the power on. Always turn off the power and unplug the power cord from the computer before changing jumper settings. Failure to do so may cause damage to the board. Figure 4 shows the location of the configuration jumpers and switches. Table 8 summarizes the supported jumpers and switches and gives their default and optional settings.
Mobile Intel® 915GME Express Chipset —Hardware Reference Table 8. Supported Configuration Jumper/Switch Settings No. Default Setting Optional Setting Option Setting Ref. Desig. 1 SIO Reset 1-2 Normal Operation 2-3 to hold the SIO in Reset J7E4 2 H8 Reset 1-2 Normal Operation 2-3 to hold the H8 in Reset J8G1 3 1 Hz Clock Out - Normal Operation IN - Clock disabled- enable H8 Programming J9G1 4 H8 Programming OUT - Normal Operation In - Enable external H8 Programming.
Hardware Reference—Mobile Intel® 915GME Express Chipset Table 9. Unsupported Jumper Default Position Jumper Pins Jumper Pins J1E2 2-3 J7C3 1-2 J1E3 2-3 J7E1 1-2 J1F2 1-X1 J7E3 1-X1 J2J2 1-2 J7J3 1-X1 J3B3 3-4 J8E1 2-3 J3C1 1-2 J8E2 2-3 J3F1 1-X1 J8F1 1-X1 J3F3 1-2 J8H1 2-3 J5G1 1-X 1 J9J2 1-2 J5G2 1-X1 J9J5 1-2 J6E1 2-3 J9J6 1-X1 J6E1 5-6 J9J7 1-X1 J6G2 1-X1 J9J8 1-2 J7B1 2-3 SW4A1 1-2 Note: 1.
Mobile Intel® 915GME Express Chipset —Hardware Reference 4.4 Power On and Reset Buttons The Mobile Intel® 915GME Express Chipset board has two push buttons, POWER and RESET. The POWER button releases power to the entire board, causing the board to boot. The RESET button will force all systems to warm reset. The two buttons are located near the CPU close to the edge of the board. The POWER button is located at SW1C2 and the RESET button is located at SW1C1. Figure 5.
Hardware Reference—Mobile Intel® 915GME Express Chipset 4.5 LEDs The following LEDs provide status for various functions on the Mobile Intel® 915GME Express Chipset board. Table 10.
Mobile Intel® 915GME Express Chipset —Hardware Reference 3. Program the H8 via the serial port. 4. Disconnect the power supply from the system. 5. With the board powered off, move the five jumpers listed in Table 11 back to the default stuffing option. Table 11.
Hardware Reference—Mobile Intel® 915GME Express Chipset into the socket, turn the screw 180 degrees clock-wise to secure the CPU in the socket. Note that the slot on the screw aligns with the lock and unlock legend on the case of the CPU socket. Caution: Please refer to the CPU installation instruction in Appendix A prior to inserting the CPU as the CPU and socket can be easily damaged. 4.6.2.2 PCI Express (x16) The platform has one 16 lane PCI Express Graphics slot and supports either x1 or x16 modes.
Mobile Intel® 915GME Express Chipset —Hardware Reference Table 13.
Hardware Reference—Mobile Intel® 915GME Express Chipset Table 13. PCI Express (x16) Pinout (J6C1) (Sheet 3 of 3) Pin 4.6.2.
Mobile Intel® 915GME Express Chipset —Hardware Reference Table 14.
Hardware Reference—Mobile Intel® 915GME Express Chipset Table 14. ADD2 Slot (J6C1) (Sheet 3 of 3) Pin Number 4.6.2.
Mobile Intel® 915GME Express Chipset —Hardware Reference Table 15. PCI Express (x1) Pinout (J7C2, J8C1 & J8D1) Pin Description Pin Description A1 PRSNT1# B1 +12 V A2 +12 V B2 +12 V A3 +12 V B3 RSVD A4 GND B4 GND A5 (JTAG) TCK B5 SMCLK A6 (JTAG) TDI B6 SMDAT A7 (JTAG) TDO B7 GND A8 (JTAG) TMS B8 +3.3 V A9 +3.3 V B9 (JTAG) TRST# A10 +3.3 V B10 +3.
Hardware Reference—Mobile Intel® 915GME Express Chipset 4.6.2.5 IDE Connector Table 16.
Mobile Intel® 915GME Express Chipset —Hardware Reference Table 18. SATA Port 2 Power Connector Pinout (J6H3) Pin Table 19. Signal 1, 2 +3.3 V 3, 4 +5 V 5 +12 V 6, 7, 8, 9, 10 GND SATA Port 0 Mobile Drive Connector Pinout (J8J3) Pin Signal 2 TX 3 TX# 5 RX 6 RX# 8, 9, 10 +3.3 V 14, 15, 16, 18 +5 V 20, 21, 22 +12 V 1, 4, 7, 11 GND 12, 13, 17, 19 GND 4.6.2.7 Fan Connectors Table 20.
Heat Sink Installation Instructions—Mobile Intel® 915GME Express Chipset Appendix A Heat Sink Installation Instructions It is necessary for the Mobile Intel® 915GME Express Chipset to have a thermal solution attached to the processor in order to keep the processor within its operating temperature. A heat sink is included in the kit. To install the heat sink: 1. Remove heat sink from its package and separate the fan sink portion from the heat sink back plate. Figure 6. Heat Sink and Back Plate 2.
Mobile Intel® 915GME Express Chipset —Heat Sink Installation Instructions Figure 7. Back Plate Pins Back plate pins 4. Clean the die of the processor with isopropyl alcohol before the heat sink is attached to the processor. This ensures that the surface of the die is clean. 5. Place the heat sink over the pins of the heat sink back plate. Slide the heat sink over the lugs on the back plate pins so that the base is directly over the processor die. Turn the heat sink clockwise until it contacts the die.
Heat Sink Installation Instructions—Mobile Intel® 915GME Express Chipset Figure 8.
