Chipper User Manual

Mechanical Drawings

Thermal and Mechanical Design Guidelines 39

Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Heatsink Assembly

()55.88

2.200[]

()33

1.299[]

()19

.748[]

()19

.748[]

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D

DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS

DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE

APPLICABLE AT PART FREE, UNCONSTRAINED ST ATE UNLESS

INDICATED OTHERWISE.

2. FINISH: NONE

3. ALL SECONDARY UNIT DIMENSIONS ARE FOR REF ERENCE ONLY. TOLERANCES

SHALL BE CALCULATED FROM PRIMARY UNITS TO AVOID TRUNCATION ERRORS.

4. ITEMS WITHOUT INTEL PART NUMBER SHALL BE MANAGED

AND PROCURED BY SUPPLIER

5 .ASSEMBLY TO BE MARKED WITH INTEL P/N APPROX. WHERE SHOWN.

6. ATTACH THERMAL INTERFACE MATERIAL WHERE SHOWN. REMOVABLE PROTECTIVE

BARRIER APPLIED OVER INTERFACE MATERIAL.

0.25 [.009] A B C