Datasheet

8.0 Package Specifications
Package Mechanical Attributes
The processors use a Flip Chip technology and Multi-Chip package (MCP) available in a
Ball Grid Array (BGA) package. The following table provides an overview of the
mechanical attributes of this package.
Table 52. Package Mechanical Attributes
Parameter Intel
®
Core
™
U-Processor
Intel
®
Pentium
®
Processor
Intel
®
Celeron
®
Processor
Intel
®
Core
™
M
Processor
Package
Technology
Package Type Flip Chip Ball Grid Array Flip Chip Ball Grid Array
Interconnect Ball Grid Array (BGA) Ball Grid Array (BGA)
Lead Free Yes Yes
Halogenated Flame
Retardant Free
Yes Yes
Package
Configuration
Solder Ball Composition SAC405 SAC405
Ball/Pin Count 1168 1234
Grid Array Pattern Balls Anywhere Balls Anywhere
Land Side Capacitors Yes Yes
Die Side Capacitors No No
Die Configuration Multi-Chip Package (MCP) / 2 dies Multi-Chip Package
(MCP) / 2 dies
Package
Dimension
Nominal Package Size 40 mm x 24 mm x
1.284 mm
30 mm x 16.5 mm x
1.05 mm
Min Ball/Pin pitch 0.65 mm 0.5 mm
8.1
Processor—Package Specifications
5th Generation Intel
®
Core
™
Processor Family, Intel
®
Core
™
M Processor Family, Mobile Intel
®
Pentium
®
Processor Family, and
Mobile Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2 March 2015
96 Order No.: 330834-004v1