Brochure

Intel® nUC KIt nUC6¡7KYK
Technical Specications
1
Software and workloads used in performance tests may have been optimized
for performance only on Intel
®
microprocessors. Performance tests, such as
SYSmark*, MobileMark*, and SPEC CPU are measured using specic computer
systems, components, software, operations and functions. Any change to any
of those factors may cause the results to vary. You should consult other informa-
tion and performance tests to assist you in fully evaluating your contemplated
purchases, including the performance of that product when combined with other
products. For more complete information about performance and benchmark
results, visit http://www.intel.com/performance.
2
Measured using 3DMark* 1.2.0 Cloud Gate for DX 10 graphics subtest - a 3D
graphics benchmark that measures 3D gaming performance. Find out more at
www.futuremark.com.
3
Requires USB-C cable.
Copyright 2016 © Intel Corporation. All rights reserved. Intel, the Intel logo, Intel Inside, the Intel Inside logo, Intel. Experience What’s Inside, the Intel. Experience What’s Inside logo, Intel Iris, Thunderbolt, Intel RealSense, and Intel Core are trademarks of
Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others. Printed in USA 0316/BCP/HBD/PDF Please Recycle 333176-001US
4
Intel technologies’ features and benets depend on system conguration and
may require enabled hardware, software or service activation. Performance var-
ies depending on system conguration. No computer system can be absolutely
secure. Check with your system manufacturer or retailer or learn more at
www.intel.com.
Intel products are not intended for use in medical, life-saving, or life-sustaining
applications. Intel may make changes to specications and product descriptions at
any time, without notice.
All products, dates, and gures specied are preliminary based on current
expectations, and are subject to change without notice. Availability in different
channels may vary.
Actual Intel
®
NUC kit may differ from the image shown.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH
INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL
OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LI-
ABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
PROCESSOR
• Intel® Core™ i7-6770HQ processor
(2.6 to 3.5 GHz turbo, Quad Core,
6 MB Cache, 45W TDP)
GRAPHICS
• Intel® Iris™ Pro Graphics 580
• One HDMI* 2.0 port
• One Mini DisplayPort* 1.2
• Thunderbolt™ 3 with support for DisplayPort* 1.2
SYSTEM MEMORY
• Two DDR4 SO-DIMM sockets
(up to 32 GB, 2133+ MHz), 1.2V, 1.35V
STORAGE CAPABILITIES
• SDXC slot with UHS-I support on the front
• Two M.2 Type M connectors supporting
22x42 or 22x80 SATA or PCIe* SSD
PERIPHERAL CONNECTIVITY
• Intel® Gigabit LAN
• One Thunderbolt™ 3 port with USB 3.1
• Four Super Hi-Speed USB 3.0 ports (two back
panel ports and two front ports including one
charging port)
• Intel® Dual Band Wireless-AC 8260 (802.11ac),
2x2, up to 867 Mbps
• Dual Mode Bluetooth* 4.2
SYSTEM BIOS
• 64 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play
• Advanced configuration and power interface
V3.0b, SMBIOS2.5
• Intel® Visual BIOS
• Intel® Express BIOS update support
HARDWARE MANAGEMENT FEATURES
• Processor fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management control
EXPANSION CAPABILITIES
• One NFC header
• Two Internal USB 2.0 ports
• Two additional Hi-Speed USB 3.0 ports
via internal headers
AUDIO
• Up to 7.1 surround audio via HDMI and
Mini DisplayPort
• Headphone/Microphone jack on the front panel
• Combo speaker/TOSLINK audio output on the
back panel
FRONT PANEL HEADER
• Reset, Power LED, power on/off
MECHANICAL CHASSIS SIZE
• 211 mm x 116 mm x 28 mm
• 8.30" x 4.56" x 1.10"
BASEBOARD POWER REQUIREMENTS
• 19V, 120W AC-DC power adapter
ENVIRONMENT OPERATING TEMPERATURE
• 0° C to +40° C
STORAGE TEMPERATURE
• -20° C to +70°
PRODUCT SAFETY REGULATIONS
AND STANDARDS
• IEC 60950-1
• UL 60950-1
• EN 60950-1
• CAN/CSA-C22.2 No. 60950-1
EMC/RF REGULATIONS AND STANDARDS
(CLASS B)
• CISPR 22
• FCC CFR Title 47, Chapter I, Part 15,
Subparts A, B
• ICES-003
• EN 55022
• EN 55024
• ETSI EN 300 328
• ETSI EN 301 489-1
• ETSI EN 301 489-17
• ETSI EN 301 893
• EN 62311
• AS/NZS 2772.2
• AS/NZS 4268
• VCCI V-3, V-4
• KN-22
• KN-24
• CNS 13438
ENVIRONMENTAL REGULATIONS
• RoHS Directive 2011/65/EU
• WEEE Directive 2012/19/EU
• China RoHS MII Order #39
Unleash your potential:
www.intel.com/changethegame