User manual

Product Description
25
1.12.4 Wireless Network Module
The Intel Dual Band Wireless-AC 8260 module provides hi-speed wireless connectivity provided
with the following capabilities:
 Compliant IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w
specifications
 Maximum bandwidth of 867 Mbps
 Dual Mode Bluetooth* 4.2
 OS certified with : Microsoft Windows 7, Microsoft Windows 8.1, Microsoft Windows 10,
Linux* (most features not available on Linux)
 Wi-Fi Direct* for peer to peer device connections
 Wi-Fi Miracast Source
 Intel® Wireless Display 6.0
 Wi-Fi Direct for peer to peer device connections
 Authentication: WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM,
EAP-AKA
 Encryption: 64-bit and 128-bit WEP, AES-CCMP, TKIP, WPA2, AES-CCMP
For information about
Refer to
Obtaining WLAN software and drivers
http://downloadcenter.intel.com
Full Specifications
http://intel.com/wireless
1.13 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The kit has several hardware management features, including
thermal and voltage monitoring.
For information about
Refer to
Wired for Management (WfM) Specification
www.intel.com/design/archives/wfm/
1.13.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577DSIO, which
supports the following:
 Processor and system ambient temperature monitoring
 Chassis fan speed monitoring
 Voltage monitoring of +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp,
 SMBus interface
1.13.2 Fan Monitoring
Fan monitoring can be implemented using third-party software.