Datasheet
4 Datasheet
5.2.2 Thermal Monitor 2 ..................................................................................77
5.2.3 On-Demand Mode...................................................................................78
5.2.4 PROCHOT# Signal ..................................................................................79
5.2.5 THERMTRIP# Signal................................................................................79
5.3 Thermal Diode...................................................................................................80
5.4 Platform Environment Control Interface (PECI) ......................................................82
5.4.1 Introduction...........................................................................................82
5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......82
5.4.2 PECI Specifications .................................................................................84
5.4.2.1 PECI Device Address..................................................................84
5.4.2.2 PECI Command Support.............................................................84
5.4.2.3 PECI Fault Handling Requirements...............................................84
5.4.2.4 PECI GetTemp0() Error Code Support ..........................................84
6Features..................................................................................................................85
6.1 Power-On Configuration Options ..........................................................................85
6.2 Clock Control and Low Power States.....................................................................86
6.2.1 Normal State .........................................................................................86
6.2.2 HALT and Extended HALT Powerdown States..............................................86
6.2.2.1 HALT Powerdown State ..............................................................87
6.2.2.2 Extended HALT Powerdown State ................................................87
6.2.3 Stop Grant and Extended Stop Grant States...............................................87
6.2.3.1 Stop-Grant State.......................................................................88
6.2.3.2 Extended Stop Grant State.........................................................88
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant
Snoop State, and Stop Grant Snoop State..................................................88
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................88
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......89
6.3 Enhanced Intel SpeedStep® Technology...............................................................89
7 Boxed Processor Specifications................................................................................91
7.1 Mechanical Specifications....................................................................................92
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................92
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................94
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly...............................................................................................94
7.2 Electrical Requirements ......................................................................................94
7.2.1 Fan Heatsink Power Supply ......................................................................94
7.3 Thermal Specifications........................................................................................96
7.3.1 Boxed Processor Cooling Requirements......................................................96
7.3.2 Fan Speed Control Operation (Intel
®
Pentium
®
Dual-Core Desktop
Processor E2160)....................................................................................98
8 Debug Tools Specifications ....................................................................................101
8.1 Logic Analyzer Interface (LAI) ...........................................................................101
8.1.1 Mechanical Considerations .....................................................................101
8.1.2 Electrical Considerations........................................................................101