Datasheet

Introduction
12 Intel® Xeon® Processor 3400 Series Datasheet, Volume 1
1.2 Interfaces
1.2.1 System Memory Support
Notes:
1. Non-ECC DIMMs are not supported. Mixing of non-ECC and ECC DIMMs is not supported.
System memory features include:
• Data burst length of eight for all memory organization modes
•64-bit wide channels
• DDR3 I/O Voltage of 1.5 V
• Maximum memory bandwidth of 10.6 GB/s in single-channel mode or 21 GB/s in
dual-channel mode assuming DDR3 1333 MT/s
• 1-Gb and 2-Gb DDR3 DRAM technologies are supported.
• Using 2-Gb device technologies, the largest memory capacity possible is 16 GB for
UDIMMs (assuming Dual Channel Mode with a four double-sided unbuffered DIMM
memory configuration), and 32 GB for RDIMMs (assuming
Dual Channel Mode with
a four quad-rank registered DIMM memory configuration
)
• Up to 64 simultaneous open pages, 32 per channel (assuming 8 ranks of 8 bank
devices)
• Command launch modes of 1n/2n
•Intel
®
Fast Memory Access (Intel
®
FMA)
— Just-in-Time Command Scheduling
—Command Overlap
— Out-of-Order Scheduling
Table 1-1. Intel
®
Xeon
®
Processor 3400 Series Supported Memory Summary
Platform Memory Type
# of
Channels
DIMMs/
Channel
Transfer
Rate
(MT/s)
Notes
Intel 3400 and 3420 Chipset
Platforms
DDR3:
ECC Registered DIMM
1 or 2 Up to 3 800, 1066,
1333
1
DDR3:
ECC Unbuffered DIMM
1 or 2 1 or 2 1066, 1333 1