Datasheet

Intel® Xeon® Processor 3400 Series Datasheet, Volume 1 3
Contents
1Introduction..............................................................................................................9
1.1 Processor Feature Details ...................................................................................11
1.1.1 Supported Technologies ..........................................................................11
1.2 Interfaces ........................................................................................................12
1.2.1 System Memory Support.........................................................................12
1.2.2 PCI Express* .........................................................................................13
1.2.3 Direct Media Interface (DMI)....................................................................14
1.2.4 Platform Environment Control Interface (PECI)...........................................14
1.3 Power Management Support ...............................................................................15
1.3.1 Processor Core.......................................................................................15
1.3.2 System.................................................................................................15
1.3.3 Memory Controller..................................................................................15
1.3.4 PCI Express* .........................................................................................15
1.4 Thermal Management Support ............................................................................15
1.5 Package...........................................................................................................15
1.6 Terminology .....................................................................................................16
1.7 Related Documents ...........................................................................................18
2Interfaces................................................................................................................19
2.1 System Memory Interface ..................................................................................19
2.1.1 System Memory Technology Supported.....................................................19
2.1.2 System Memory Timing Support...............................................................20
2.1.3 System Memory Organization Modes.........................................................20
2.1.3.1 Single-Channel Mode.................................................................20
2.1.3.2 Dual-Channel Mode — Intel
®
Flex Memory Technology Mode..........21
2.1.4 Rules for Populating Memory Slots............................................................22
2.1.5 Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA)..........23
2.1.5.1 Just-in-Time Command Scheduling..............................................23
2.1.5.2 Command Overlap....................................................................23
2.1.5.3 Out-of-Order Scheduling............................................................23
2.1.6 System Memory Pre-Charge Power Down Support Details............................23
2.2 PCI Express* Interface.......................................................................................24
2.2.1 PCI Express* Architecture .......................................................................24
2.2.1.1 Transaction Layer .....................................................................25
2.2.1.2 Data Link Layer ........................................................................25
2.2.1.3 Physical Layer ..........................................................................25
2.2.2 PCI Express* Configuration Mechanism .....................................................26
2.2.3 PCI Express* Ports and Bifurcation ...........................................................26
2.2.3.1 PCI Express* Bifurcated Mode ....................................................27
2.3 Direct Media Interface (DMI)...............................................................................27
2.3.1 DMI Error Flow.......................................................................................27
2.3.2 Processor/PCH Compatibility Assumptions..................................................27
2.3.3 DMI Link Down ......................................................................................27
2.4 Platform Environment Control Interface (PECI)......................................................28
2.5 Interface Clocking .............................................................................................28
2.5.1 Internal Clocking Requirements................................................................28
3 Technologies ...........................................................................................................29
3.1 Intel
®
Virtualization Technology..........................................................................29
3.1.1 Intel
®
VT-x Objectives............................................................................29
3.1.2 Intel
®
VT-x Features ..............................................................................29