Datasheet

Intel® Xeon® Processor 3400 Series Datasheet, Volume 1 73
Electrical Specifications
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The V
TT
referred to in these specifications refers to instantaneous V
TT
.
3. For V
IN
between “0” V and V
TT
. Measured when the driver is tristated.
4. V
IH
and V
OH
may experience excursions above V
TT
. However, input signal drivers must comply with the signal quality
specifications.
5. COMP resistance must be provided on the system board with 1% resistors. COMP resistors are to V
SS
.
6. R
SYS_TERM
is the system termination on the signal.
Table 7-9. Control Sideband and TAP Signal Group DC Specifications
Symbol Alpha Group Parameter Min Typ Max Units Notes
1
V
IL
(m),(n),(p),(qa),(qb),(s) Input Low Voltage — — 0.64
*
V
TT
V2
V
IH
(m),(n),(p),(qa),(qb),(s) Input High Voltage 0.76
*
V
TT
—— V2,4
V
IL
(g) Input Low Voltage — — 0.4
*
V
TT
V2
V
IH
(g) Input High Voltage 0.75
*
V
TT
—— V2,4
V
IL
(ja) Input Low Voltage — — 0.25
*
V
TT
V2
V
IH
(ja) Input High Voltage 0.75
*
V
TT
—— V2,4
V
IL
(jb) Input Low Voltage — — 0.29 V 2
V
IH
(jb) Input High Voltage 0.87 — — V 2,4
V
OL
(k),(l),(n),(p),(r),
(s),(h),(i)
Output Low Voltage
——
V
TT
* R
ON
/
(R
ON
+
R
SYS_TERM
)
V2,6
V
OH
(k),(l),(n),(p),
(r),(s),(i)
Output High Voltage
V
TT
—— V2,4
R
ON
Buffer on Resistance 10 — 18 Ω
I
LI
(ja),(jb),(m),(n),
(p),(qa),(s),(t),(g)
Input Leakage Current
— — ±200 μA3
I
LI
(qb) Input Leakage Current — — ±100 μA3
COMP0 (t) COMP Resistance 49.4 49.9 50.4 Ω 5
COMP1 (t) COMP Resistance 49.4 49.9 50.4 Ω 5
COMP2 (t) COMP Resistance 19.8 20 20.2 Ω 5
COMP3 (t) COMP Resistance 19.8 20 20.2 Ω 5