Specification Sheet

Overview
Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families 11
Datasheet Volume One of Two
Overview
11
1 Overview
1.1 Introduction
The Intel
®
Xeon
®
processor E5-1600/E5-2600/E5-4600 v2 product families - Volume
One provides DC electrical specifications, signal integrity, differential signaling
specifications, land and signal definitions, and an overview of additional processor
feature interfaces.
This document is intended to be distributed as a part of the complete document
which
consists of 2 volumes. The structure and scope of the 2 volumes are provided in
Ta b l e 1-2.
The Intel
®
Xeon
®
processor E5-1600/E5-2600/E5-4600 v2 product families are the
next generation of 64-bit, multi-core enterprise processors built on 22-nanometer
process technology.
Throughout this document, the Intel
®
Xeon
®
processor E5-1600/E5-2600/E5-4600 v2
product families may be referred to as simply the processor. Where information differs
between the EP and EP 4S SKUs, this document uses specific Intel
®
Xeon
®
processor
E5-1600 v2 product family, Intel
®
Xeon
®
processor E5-2600 v2 product family, and
Intel® Xeon® processor E5-4600 v2 product family notation.
Based on the low-power/high performance Ivy Bridge processor microarchitecture, the
processor is designed for a two-chip platform as opposed
to the traditional three-chip
platforms (processor, MCH, and ICH). The two-chip platform consists of a processor
and the Platform Controller Hub (PCH) and enables higher performance, easier
validation, and improved x-y footprint.
This generation of processor introduces the High-Core count (HCC), Mid-Core count
(MCC), and Lo
w-Core count (L
CC) die size terminology to the SKU models. The table
below summarizes the die size associated with the processor TDP, Model Number, and
Core Count.
Table 1-1. HCC, MCC, and LCC SKU Table Summary (Sheet 1 of 2)
Die Size TDP (W) Model Number Core Count
High-Core Count (HCC) 130W 1U E5-2697 v2 12
115W 1U E5-2695 v2
E5-4657L v2
12
95W 1U E5-4610 v2 8