Specification Sheet

4Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families
Datasheet Volume One of Two
3.2.3 AES Instructions.....................................................................................84
3.2.4 Execute Disable Bit .................................................................................85
3.3 Intel
®
Secure Key..............................................................................................85
3.4 Intel
®
OS Guard................................................................................................85
3.5 Intel® Hyper-Threading Technology.....................................................................85
3.6 Intel
®
Turbo Boost Technology ............................................................................86
3.6.1 Intel
®
Turbo Boost Operating Frequency....................................................86
3.7 Enhanced Intel SpeedStep® Technology...............................................................86
3.8 Intel® Intelligent Power Technology.....................................................................87
3.9 Intel® Advanced Vector Extensions (Intel® AVX) ..................................................87
3.10 Intel
®
Dynamic Power Technology .......................................................................88
4 Power Management .................................................................................................89
4.1 ACPI States Supported .......................................................................................89
4.1.1 System States........................................................................................89
4.1.2 Processor Package and Core States ...........................................................89
4.1.3 Integrated Memory Controller States.........................................................90
4.1.4 DMI2/PCI Express* Link States.................................................................91
4.1.5 Intel® QuickPath Interconnect States........................................................91
4.1.6 G, S, and C State Combinations................................................................91
4.2 Processor Core/Package Power Management .........................................................92
4.2.1 Enhanced Intel SpeedStep® Technology....................................................92
4.2.2 Low-Power Idle States.............................................................................92
4.2.3 Requesting Low-Power Idle States ............................................................93
4.2.4 Core C-states .........................................................................................94
4.2.5 Package C-States ...................................................................................95
4.2.6 Package C-State Power Specifications........................................................99
4.2.7 Processor Package Power Specifications .....................................................99
4.3 System Memory Power Management ..................................................................100
4.3.1 CKE Power-Down.................................................................................. 100
4.3.2 Self Refresh .........................................................................................101
4.3.3 DRAM I/O Power Management................................................................101
4.4 DMI2/PCI Express* Power Management.............................................................. 102
5 Thermal Management Specifications...................................................................... 103
5.1 Package Thermal Specifications ......................................................................... 103
5.1.1 Thermal Specifications...........................................................................103
5.1.2 TCASE and DTS Based Thermal Specifications...........................................105
5.1.3 Processor Operational Thermal Specifications ........................................... 106
5.1.4 Embedded Server Thermal Profiles.......................................................... 110
5.1.5 Thermal Metrology................................................................................ 113
5.2 Processor Core Thermal Features ....................................................................... 114
5.2.1 Processor Temperature.......................................................................... 114
5.2.2 Adaptive Thermal Monitor ......................................................................114
5.2.3 On-Demand Mode.................................................................................117
5.2.4 PROCHOT_N Signal ...............................................................................118
5.2.5 THERMTRIP_N Signal ............................................................................118
5.2.6 Integrated Memory Controller (IMC) Thermal Features...............................119
6 Signal Descriptions ................................................................................................121
6.1 System Memory Interface Signals ......................................................................121
6.2 PCI Express* Based Interface Signals .................................................................122
6.3 DMI2/PCI Express* Port 0 Signals...................................................................... 124
6.4 Intel® QuickPath Interconnect Signals ............................................................... 124
6.5 PECI Signal.....................................................................................................125
6.6 System Reference Clock Signals ........................................................................ 125
6.7 JTAG and TAP Signals.......................................................................................125
6.8 Serial VID Interface (SVID) Signals ....................................................................126