Specification Sheet

Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families 5
Datasheet Volume One of Two
6.9 Processor Asynchronous Sideband and Miscellaneous Signals ................................ 126
6.10 Processor Power and Ground Supplies ................................................................ 129
7 Electrical Specifications......................................................................................... 131
7.1 Processor Signaling ......................................................................................... 131
7.1.1 System Memory Interface Signal Groups ................................................. 131
7.1.2 PCI Express Signals .............................................................................. 131
7.1.3 DMI2/PCI Express Signals ..................................................................... 131
7.1.4 Intel
®
QuickPath Interconnect ............................................................... 131
7.1.5 Platform Environmental Control Interface (PECI) ...................................... 132
7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 132
7.1.7 JTAG and Test Access Port (TAP) Signals ................................................. 133
7.1.8 Processor Sideband Signals ................................................................... 133
7.1.9 Power, Ground and Sense Signals........................................................... 133
7.1.10 Reserved or Unused Signals................................................................... 138
7.2 Signal Group Summary .................................................................................... 138
7.3 Power-On Configuration (POC) Options............................................................... 142
7.4 Fault Resilient Booting (FRB)............................................................................. 142
7.5 Mixing Processors............................................................................................ 143
7.6 Flexible Motherboard Guidelines (FMB)............................................................... 144
7.7 Absolute Maximum and Minimum Ratings ........................................................... 144
7.7.1 Storage Condition Specifications............................................................. 144
7.8 DC Specifications ............................................................................................ 145
7.8.1 Voltage and Current Specifications.......................................................... 145
7.8.2 Die Voltage Validation........................................................................... 150
7.8.3 Signal DC Specifications ........................................................................ 151
7.9 Signal Quality ................................................................................................. 158
7.9.1 DDR3 Signal Quality Specifications ......................................................... 158
7.9.2 I/O Signal Quality Specifications............................................................. 158
7.9.3 Intel
®
QuickPath Interconnect Signal Quality Specifications ....................... 159
7.9.4 Input Reference Clock Signal Quality Specifications................................... 159
7.9.5 Overshoot/Undershoot Tolerance............................................................ 159
8 Processor Land Listing........................................................................................... 163
8.1 Listing by Land Name ...................................................................................... 163
8.2 Listing by Land Number ................................................................................... 187
9 Package Mechanical Specifications ........................................................................ 213
9.1 Package Size and SKUs .................................................................................... 213
9.2 Package Mechanical Drawing (PMD) ................................................................... 214
9.3 Processor Component Keep-Out Zones............................................................... 219
9.4 Package Loading Specifications ......................................................................... 219
9.5 Package Handling Guidelines............................................................................. 219
9.6 Package Insertion Specifications........................................................................ 219
9.7 Processor Mass Specification............................................................................. 220
9.8 Processor Materials.......................................................................................... 220
9.9 Processor Markings.......................................................................................... 220
10 Boxed Processor Specifications ............................................................................. 221
10.1 Introduction ................................................................................................... 221
10.1.1 Available Boxed Thermal Solution Configurations ...................................... 221
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution) ...................................... 221
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions).................................... 222
10.2 Mechanical Specifications ................................................................................. 223
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........ 223
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS) ...... 232