Specification Sheet

Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families 7
Datasheet Volume One of Two
2-40 Caching Agent TOR Read Data ............................................................................ 62
2-41 DTS Thermal Margin Read .................................................................................. 62
2-42 Processor ID Construction Example...................................................................... 63
2-43 RdIAMSR() ....................................................................................................... 64
2-44 PCI Configuration Address .................................................................................. 66
2-45 RdPCIConfig()................................................................................................... 67
2-46 PCI Configuration Address for local accesses ......................................................... 68
2-47 RdPCIConfigLocal()............................................................................................ 68
2-48 WrPCIConfigLocal() ........................................................................................... 70
2-49 The Processor PECI Power-up Timeline() .............................................................. 72
2-50 Temperature Sensor Data Format........................................................................ 78
4-1 Idle Power Management Breakdown of the Processor Cores..................................... 93
4-2 Thread and Core C-State Entry and Exit ............................................................... 93
4-3 Package C-State Entry and Exit ........................................................................... 97
5-1 TCase Temperature Thermal Profile ................................................................... 108
5-2 Digital Thermal Sensor DTS Thermal Profile ........................................................ 110
5-3 Embedded Case Temperature Thermal Profile...................................................... 112
5-4 Embedded DTS Thermal Profile ......................................................................... 113
5-5 Case Temperature (TCASE) Measurement Location .............................................. 114
5-6 Frequency and Voltage Ordering........................................................................ 117
7-1 Input Device Hysteresis ................................................................................... 132
7-2 VR Power-State Transitions............................................................................... 136
7-3 Processor VCC Static and Transient Tolerance Loadlines ....................................... 149
7-4 Load Current Versus Time ................................................................................ 150
7-5 VCC Overshoot Example Waveform.................................................................... 151
7-6 BCLK{0/1} Differential Clock Crosspoint Specification .......................................... 157
7-7 BCLK{0/1} Differential Clock Measurement Point for Ringback .............................. 157
7-8 BCLK{0/1} Single Ended Clock Measurement Points for Absolute Cross Point
and Swing ...................................................................................................... 157
7-9 BCLK{0/1} Single Ended Clock Measurement Points for Delta Cross Point ............... 158
7-10 Maximum Acceptable Overshoot/Undershoot Waveform........................................ 161
9-1 Processor Package Assembly Sketch .................................................................. 213
9-2 Processor PMD Package A (52.5 x 45 mm) Sheet 1 of 2........................................ 215
9-3 Processor PMD Package A (52.5 x 45 mm) Sheet 2 of 2........................................ 216
9-4 Processor PMD Package B (52.5 x 51 mm) Sheet 1 of 2........................................ 217
9-5 Processor PMD Package B (52.5 x 51 mm) Sheet 2 of 2........................................ 218
9-6 Processor Top-Side Markings ........................................................................... 220
10-1 STS200C Passive/Active Combination Heat Sink (with Removable Fan)................... 222
10-2 STS200C Passive/Active Combination Heat Sink (with Fan Removed) ..................... 222
10-3 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks................................ 223
10-4 Boxed Processor Motherboard Keepout Zones (1 of 4).......................................... 224
10-5 Boxed Processor Motherboard Keepout Zones (2 of 4).......................................... 225
10-6 Boxed Processor Motherboard Keepout Zones (3 of 4).......................................... 226
10-7 Boxed Processor Motherboard Keepout Zones (4 of 4).......................................... 227
10-8 Boxed Processor Heat Sink Volumetric (1 of 2) .................................................... 228
10-9 Boxed Processor Heat Sink Volumetric (2 of 2) .................................................... 229
10-10 4-Pin Fan Cable Connector (For Active Heat Sink) ................................................ 230
10-11 4-Pin Base Baseboard Fan Header (For Active Heat Sink)...................................... 231
10-12 Fan Cable Connector Pin Out For 4-Pin Active Thermal Solution ............................. 233