Datasheet

Mobile Intel
®
Pentium
®
III Processor in BGA2 and Micro-PGA2 Packages at 1 GHz,
900 MHz, 850 MHz, 800 MHz, 750 MHz, 700 MHz, Low-voltage 750 MHz, Low-voltage
700 MHz, Low-voltage 600 MHz, Ultra Low-voltage 600 MHz and Ultra Low-voltage 500 MHz
283653-002 Datasheet 49
5. Mechanical Specifications
5.1 Surface-mount BGA2 Package Dimensions
The mobile Pentium III processor is packaged in a PBGA-B495 package (also known as BGA2)
with the back of the processor die exposed on top. Unlike previous mobile processors with
exposed die, the back of the mobile Pentium III processor die may be polished and very smooth.
The mechanical specifications for the surface-mount package are provided in Table 28. Figure 21
shows the top and side views of the surface-mount package, and Figure 22 shows the bottom view
of the surface-mount package. The substrate may only be contacted within the shaded region
between the keep-out outline and the edge of the substrate. The mobile Pentium III processor will
have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Please note that in order to implement VID on the BGA2 package,
some VID[4:0] balls may be depopulated.
Table 28. Surface-mount BGA2 Package Specifications
Symbol Parameter Min Max Unit
A Overall Height, as delivered 2.29 2.79 mm
A
1
Substrate Height, as delivered 1.50 REF mm
A
2
Die Height 0.854 REF mm
b Ball Diameter 0.78 REF mm
D Package Width 27.05 27.35 mm
D
1
Die Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
mm
E Package Length 30.85 31.15 mm
e Ball Pitch 1.27 mm
E
1
Die Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
mm
N Ball Count 495
1
each
S
1
Outer Ball Center to Short Edge of Substrate 0.895 REF mm
S
2
Outer Ball Center to Long Edge of Substrate 0.900 REF mm
P
DIE
Allowable Pressure on the Die for Thermal Solution — 689 kPa
W Package Weight 4.5 REF grams
NOTE: Exact ball count will vary depending on VID[4:0] encoding. See VID[4:0] signal description.