Intel Celeron D Processor 300 Sequence
Table Of Contents
- Contents
- Revision History
- 1 Introduction
- 2 Electrical Specifications
- 2.1 FSB and GTLREF
- 2.2 Power and Ground Lands
- 2.3 Decoupling Guidelines
- 2.4 Voltage Identification
- 2.5 Reserved, Unused, and TESTHI Signals
- 2.6 FSB Signal Groups
- 2.7 GTL+ Asynchronous Signals
- 2.8 Test Access Port (TAP) Connection
- 2.9 FSB Frequency Select Signals (BSEL[2:0])
- 2.10 Absolute Maximum and Minimum Ratings
- 2.11 Processor DC Specifications
- 2.12 VCC Overshoot Specification
- 2.13 GTL+ FSB Specifications
- 3 Package Mechanical Specifications
- 4 Land Listing and Signal Descriptions
- 5 Thermal Specifications and Design Considerations
- 6 Features
- 7 Boxed Processor Specifications
- 8 Debug Tools Specifications
38 Datasheet
Package Mechanical Specifications
3.5 Package Insertion Specifications
The Celeron D processor in the 775-land package can be inserted into and removed from a
LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the
LGA775 Socket Mechanical Design Guide.
3.6 Processor Mass Specification
The typical mass of the Celeron D processor in the 775-land package is 21.5 g [0.76 oz]. This mass
[weight] includes all the components that are included in the package.
3.7 Processor Materials
Table 3-3 lists some of the package components and associated materials.
3.8 Processor Markings
Figure 3-6 and Figure 3-6 show the topside markings on the processor. This diagrams are to aid in
the identification of the Celeron D processor in the 775-land package.
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 3-5. Processor Top-Side Marking Example (with Processor Number)
2D Matrix
I
Celeron® D
346 SL7NX XXXXX
3.06GHz/256/533
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‘04
Processor
Number