Intel Celeron D Processor 300 Sequence

4 Datasheet
5.2.2 Thermal Monitor 2 ..................................................................................75
5.2.3 On-Demand Mode..................................................................................76
5.2.4 PROCHOT# Signal ................................................................................ 77
5.2.5 THERMTRIP# Signal .............................................................................77
5.2.6 T
CONTROL
and Fan Speed Reduction ....................................................77
5.2.7 Thermal Diode........................................................................................78
6 Features...........................................................................................................................79
6.1 Power-On Configuration Options ........................................................................79
6.2 Clock Control and Low Power States.................................................................. 79
6.2.1 Normal State ..........................................................................................80
6.2.2 HALT Powerdown State......................................................................... 80
6.2.3 Stop-Grant States ..................................................................................81
6.2.4 HALT Snoop State, Grant Snoop State ................................................. 81
7 Boxed Processor Specifications....................................................................................... 83
7.1 Mechanical Specifications...................................................................................84
7.1.1 Boxed Processor Cooling Solution Dimensions.....................................84
7.1.2 Boxed Processor Fan Heatsink Weight..................................................86
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach
Clip Assembly ........................................................................................86
7.2 Electrical Requirements ......................................................................................86
7.2.1 Fan Heatsink Power Supply...................................................................86
7.3 Thermal Specifications........................................................................................ 88
7.3.1 Boxed Processor Cooling Requirements ...............................................88
7.3.2 Variable Speed Fan ...............................................................................90
8 Debug Tools Specifications.............................................................................................. 93
8.1 Logic Analyzer Interface (LAI).............................................................................93
8.1.1 Mechanical Considerations ....................................................................93
8.1.2 Electrical Considerations........................................................................93