Intel Celeron D Processor 300 Sequence
Table Of Contents
- Contents
- Revision History
- 1 Introduction
- 2 Electrical Specifications
- 2.1 FSB and GTLREF
- 2.2 Power and Ground Lands
- 2.3 Decoupling Guidelines
- 2.4 Voltage Identification
- 2.5 Reserved, Unused, and TESTHI Signals
- 2.6 FSB Signal Groups
- 2.7 GTL+ Asynchronous Signals
- 2.8 Test Access Port (TAP) Connection
- 2.9 FSB Frequency Select Signals (BSEL[2:0])
- 2.10 Absolute Maximum and Minimum Ratings
- 2.11 Processor DC Specifications
- 2.12 VCC Overshoot Specification
- 2.13 GTL+ FSB Specifications
- 3 Package Mechanical Specifications
- 4 Land Listing and Signal Descriptions
- 5 Thermal Specifications and Design Considerations
- 6 Features
- 7 Boxed Processor Specifications
- 8 Debug Tools Specifications
Datasheet 5
Figures
2-1 Phase Lock Loop (PLL) Filter Requirements ......................................................19
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A .......................27
2-3 VCC Overshoot Example Waveform...................................................................30
3-1 Processor Package Assembly Sketch.................................................................33
3-2 Processor Package Drawing 1 ............................................................................34
3-3 Processor Package Drawing 2 ............................................................................35
3-4 Processor Package Drawing 3 ............................................................................36
3-5 Processor Top-Side Marking Example (with Processor Number) .......................38
3-6 Processor Top-Side Marking Example................................................................39
3-7 Processor Land Coordinates (Top View) ............................................................40
4-1 Landout Diagram (Top View – Left Side) ............................................................42
4-2 Landout Diagram (Top View – Right Side)..........................................................43
5-1 Thermal Profile for Platform Compatibility Guide ‘04 A Processors....................73
5-2 Case Temperature (TC) Measurement Location.................................................74
5-3 Thermal Monitor 2 Frequency and Voltage Ordering..........................................76
6-1 Processor Low Power State Machine .................................................................80
7-1 Mechanical Representation of the Boxed Processor ..........................................83
7-2 Space Requirements for the Boxed Processor (Side View)................................84
7-3 Space Requirements for the Boxed Processor (Top View).................................85
7-4 Space Requirements for the Boxed Processor (Overall View)............................85
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description.................87
7-6 Baseboard Power Header Placement Relative to Processor Socket..................88
7-7 Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Top View) ..89
7-8 Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Side View) .89
7-9 Boxed Processor Fan Heatsink Set Points .........................................................90