Intel Celeron D Processor 300 Sequence

6 Datasheet
Tables
1-1 References.......................................................................................................... 13
2-1 Core Frequency to FSB Multiplier Configuration................................................. 16
2-2 Voltage Identification Definition...........................................................................18
2-3 FSB Signal Groups ............................................................................................. 21
2-4 Signal Characteristics .........................................................................................22
2-5 Signal Reference Voltages..................................................................................22
2-6 BSEL[2:0] Frequency Table for BCLK[1:0] .........................................................23
2-7 Processor DC Absolute Maximum Ratings ......................................................... 24
2-8 Voltage and Current Specifications.....................................................................25
2-9 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors....26
2-10 GTL+ Asynchronous Signal Group DC Specifications....................................... 28
2-11 GTL+ Signal Group DC Specifications................................................................28
2-12 PWRGOOD and TAP Signal Group DC Specifications ......................................29
2-13 VTTPWRGD DC Specifications ..........................................................................29
2-14 BSEL [2:0] and VID[5:0] DC Specifications......................................................... 29
2-15 BOOTSELECT DC Specifications....................................................................... 29
2-16 VCC Overshoot Specifications............................................................................30
2-17 GTL+ Bus Voltage Definitions.............................................................................31
3-1 Processor Loading Specifications .......................................................................37
3-2 Package Handling Guidelines ............................................................................. 37
3-3 Processor Materials ............................................................................................38
4-1 Alphabetical Land Assignments .......................................................................... 44
4-2 Numerical Land Assignments .............................................................................53
4-3 Signal Description ...............................................................................................62
5-1 Processor Thermal Specifications.......................................................................72
5-2 Thermal Profile for Processors............................................................................73
5-3 Thermal Diode Parameters .................................................................................78
5-4 Thermal Diode Interface......................................................................................78
6-1 Power-On Configuration Option Signals .............................................................79
7-1 Fan Heatsink Power and Signal Specifications................................................... 87
7-2 Boxed Processor Fan Heatsink Set Points .........................................................91