Intel Celeron D Processor 300 Sequence
Table Of Contents
- Contents
- Revision History
- 1 Introduction
- 2 Electrical Specifications
- 2.1 FSB and GTLREF
- 2.2 Power and Ground Lands
- 2.3 Decoupling Guidelines
- 2.4 Voltage Identification
- 2.5 Reserved, Unused, and TESTHI Signals
- 2.6 FSB Signal Groups
- 2.7 GTL+ Asynchronous Signals
- 2.8 Test Access Port (TAP) Connection
- 2.9 FSB Frequency Select Signals (BSEL[2:0])
- 2.10 Absolute Maximum and Minimum Ratings
- 2.11 Processor DC Specifications
- 2.12 VCC Overshoot Specification
- 2.13 GTL+ FSB Specifications
- 3 Package Mechanical Specifications
- 4 Land Listing and Signal Descriptions
- 5 Thermal Specifications and Design Considerations
- 6 Features
- 7 Boxed Processor Specifications
- 8 Debug Tools Specifications

Datasheet 73
Thermal Specifications and Design Considerations
Table 5-2. Thermal Profile for Processors
Power (W) Maximum T
C
(°C) Power (W) Maximum T
C
(°C) Power (W) Maximum T
C
(°C)
0 44.2 30 52.6 60 61.0
2 44.8 32 53.2 62 61.6
4 45.3 34 53.7 64 62.1
6 45.9 36 54.3 66 62.7
8 46.4 38 54.8 68 63.2
10 47.0 40 55.4 70 63.8
12 47.6 42 56.0 72 64.4
14 48.1 44 56.5 74 64.9
16 48.7 46 57.1 76 65.5
18 49.2 48 57.6 78 66.0
20 49.8 50 58.2 80 66.6
22 50.4 52 58.8 82 67.2
24 50.9 54 59.3 84 67.7
26 51.5 56 59.9
28 52.0 58 60.4
Figure 5-1. Thermal Profile for Platform Compatibility Guide ‘04 A Processors
y = 0.28x + 44.2
40.0
45.0
50.0
55.0
60.0
65.0
70.0
0 1020304050607080
Power (W)
Tcase (C)