Intel Celeron D Processor 300 Sequence

Table Of Contents

Datasheet 83

Boxed Processor Specifications

7 Boxed Processor Specifications

The Celeron D processor in the 775-land package will also be offered as an boxed Intel processor.

Boxed Intel processors are intended for system integrators who build systems from baseboards and

standard components. The boxed Celeron D processor in the 775-land package will be supplied

with a cooling solution. This chapter documents baseboard and system requirements for the

cooling solution that will be supplied with the boxed Celeron D processor in the 775-land package.

This chapter is particularly important for OEMs that manufacture baseboards for system

integrators. Figure 7-1 shows a mechanical representation of a boxed Celeron D processor in the

775-land package.

Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets].

Note: Drawings in this section reflect only the specifications on the boxed Intel processor product. These

dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system

designer’s responsibility to consider their proprietary cooling solution when designing to the

required keep-out zone on their system platforms and chassis. Refer to the Intel

Pentium

Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guide for further

guidance.

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Figure 7-1. Mechanical Representation of the Boxed Processor