Intel Celeron D Processor 300 Sequence
Table Of Contents
- Contents
- Revision History
- 1 Introduction
- 2 Electrical Specifications
- 2.1 FSB and GTLREF
- 2.2 Power and Ground Lands
- 2.3 Decoupling Guidelines
- 2.4 Voltage Identification
- 2.5 Reserved, Unused, and TESTHI Signals
- 2.6 FSB Signal Groups
- 2.7 GTL+ Asynchronous Signals
- 2.8 Test Access Port (TAP) Connection
- 2.9 FSB Frequency Select Signals (BSEL[2:0])
- 2.10 Absolute Maximum and Minimum Ratings
- 2.11 Processor DC Specifications
- 2.12 VCC Overshoot Specification
- 2.13 GTL+ FSB Specifications
- 3 Package Mechanical Specifications
- 4 Land Listing and Signal Descriptions
- 5 Thermal Specifications and Design Considerations
- 6 Features
- 7 Boxed Processor Specifications
- 8 Debug Tools Specifications
84 Datasheet
Boxed Processor Specifications
7.1 Mechanical Specifications
7.1.1 Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Celeron D processor in the
775- land package fan heatsink. The boxed processor will be shipped with an unattached fan
heatsink. Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor in the
775-land package.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in Figure 7-2 (Side View), and Figure 7-3 (Top View). The airspace requirements for the
boxed processor fan heatsink must also be incorporated into new baseboard and system designs.
Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have
centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
Figure 7-2. Space Requirements for the Boxed Processor (Side View)
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]