Design Guide

Platform Design Checklist
R
Intel
®
855GM/855GME Chipset Platform Design Guide 285
Pin Name System
Pull-up/Pull-down
Series
Termination
Voltage
Translation
Notes
9
RESET#
54.9
Ω ± 1% pull-up to
VCCP
If USING
ITP700FLEX
22.6 Ω ± 1%
from pull-up to
ITP700FLEX
If ITP700FLEX is Not Used: Point-to-
point connection to GMCH.
If ITP700FLEX is Used: RESET#
connects from processor to GMCH and
then forks out to ITP700 FLEX, with pull-
up and series damping resistor placed
next to ITP.
RSVD (pin
AC1, AF7, C3,
C14, E26, G1)
Route to test points.
SLP# Point-to-point connection to ICH4-M.
SMI# Point-to-point connection to ICH4-M.
STPCLK# Point-to-point connection to ICH4-M.
TEST[3:1]
1 k
Ω pull-down to gnd
(default: no stuff)
For each signal, stuffing option for pull-
down should be provided for testing
purposes. For normal operation, leave
the resistors unpopulated.
THERMTRIP#
56
Ω pull-up to VCCP 56 Ω from pull-
up to ICH4-M pin
Point-to-point connection to ICH4-M, with
pull-up and series resistors placed by
ICH4-M. THERMTRIP# is a VCCP
signal. If connecting to other device,
voltage translation logic may be required.
VCC[71:0] Connect to VccCORE
VCCA[3:0] Connect to Vcc1_8 Connect to Vcc1_8 for Intel Pentium M
processor. Connect to either Vcc1_8 or
Vcc1_5 for Intel Pentium M Processor on
90 nm Process with 2 MB L2 Cache.
VCCP[26:0] Connect to VCCP
VCCSENSE,
VSSSENSE
54.9
Ω ± 1% pull-
down to gnd
(default: no stuff)
For each signal, stuffing option for pull-
down should be provided for testing
purposes. Also, a test point for
differential probe ground should be
placed between the two resistors. For
normal operation, leave the resistors
unpopulated.
VSS[191:0] Connect to gnd