Intel Core2 Duo Processor E8000 and E7000 Series and Intel Pentium Processor E5000 Series

Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 101
Figure 7-31. Thermocouple placed into groove
29. Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (
Figure 7-32).
Figure
7-32. Removing Excess Solder
Note: Take usual precautions when using open blades
30. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (
Figure 7-33).