Intel Core2 Duo Processor E8000 and E7000 Series and Intel Pentium Processor E5000 Series

Introduction
Thermal and Mechanical Design Guidelines 13
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Location
Intel
®
Core
™
2 Duo Processor E8000 and E7000 Series
Datasheet
www.intel.com/design/processor/d
atashts/318732.htm
Intel
®
Pentium
®
Dual-Core Processor E5000 Series
Datasheet
http://download.intel.com/design/p
rocessor/datashts/320467.pdf
LGA775 Socket Mechanical Design Guide http://developer.intel.com/design/P
entium4/guides/302666.htm
uATX SFF Design Guidance http://www.formfactors.org/
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
ATX Thermal Design Suggestions http://www.formfactors.org/
microATX Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design
Guide
http://www.formfactors.org/
Thermally Advantaged Chassis Design Guide http://www.intel.com/go/chassis/
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The
ambient temperature should be measured just upstream of a passive
heatsink or at the fan inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center
of the topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This
temperature is usually measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at
a location corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of
thermal solution performance using total package power. Defined as
(T
C
– T
A
) / Total Package Power.
Note: Heat source must be specified for
Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal
interface material performance using total package power. Defined as
(T
C
– T
S
) / Total Package Power.
Note: Heat source must be specified for
Ψ measurements.