Intel Core2 Duo Processor E8000 and E7000 Series and Intel Pentium Processor E5000 Series

ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines 53
6 ATX Thermal/Mechanical
Design Information
6.1 ATX Reference Design Requirements
This chapter will document the requirements for an active air-cooled design, with a
fan installed at the top of the heatsink. The thermal technology required for the
processor.
The Intel
®
Core
™
2 Duo processor E8000, E7000 series, and Intel
®
Pentium dual-core
processor E5000 series require a thermal solution equivalent to the E18764-001
reference design; see
Figure 6-1 for an exploded view of this reference design.
Note: The part number E18764-001 provided in this document is for reference only. The
revision number -001 may be subject to change without notice.
The E18764-001 reference design takes advantage of an acoustic improvement to
reduce the fan speed to show the acoustic advantage (its acoustic results show in the
Table 6–2).
The E18764-001 reference design takes advantage of the cost savings for the several
features of the design including the reduced heatsink height, inserted aluminum core
and the new TIM material (Dow Corning TC-1996 grease), see
Figure 6-2. The overall
46mm height thermal solution supports the unique and smaller desktop PCs including
small and ultra small form factors, down to the 5L size, see uATX SFF Guidance for
additional details on uATX SFF design.