Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

4 Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
5 Pin Listing and Signal Definitions.....................................................................59
5.1 Processor Pin Assignments ................................................................................59
5.2 Alphabetical Signals Reference ..........................................................................72
6 Thermal Specifications and Design Considerations.................................81
6.1 Processor Thermal Specifications.......................................................................82
6.1.1 Thermal Specifications...........................................................................82
6.1.2 Thermal Metrology .................................................................................83
6.1.2.1 Processor Case Temperature Measurement ............................83
7Features.......................................................................................................................85
7.1 Power-On Configuration Options ........................................................................85
7.2 Clock Control and Low Power States..................................................................85
7.2.1 Normal State—State 1 ...........................................................................85
7.2.2 AutoHALT Powerdown State—State 2 ..................................................86
7.2.3 Stop-Grant State—State 3 .....................................................................87
7.2.4 HALT/Grant Snoop State—State 4 ........................................................87
7.2.5 Sleep State—State 5..............................................................................88
7.3 Thermal Monitor..................................................................................................88
7.3.1 Thermal Diode........................................................................................90
8 Boxed Processor Specifications .......................................................................91
8.1 Introduction .........................................................................................................91
8.2 Mechanical Specifications...................................................................................92
8.2.1 Boxed Processor Cooling Solution Dimensions.....................................92
8.2.2 Boxed Processor Fan Heatsink Weight..................................................93
8.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly..........93
8.3 Electrical Requirements ......................................................................................94
8.3.1 Fan Heatsink Power Supply...................................................................94
8.4 Thermal Specifications........................................................................................97
8.4.1 Boxed Processor Cooling Requirements ...............................................97
8.4.2 Variable Speed Fan ...............................................................................98
9 Debug Tools Specifications............................................................................... 101
9.1 Logic Analyzer Interface (LAI)...........................................................................101
9.1.1 Mechanical Considerations ..................................................................101
9.1.2 Electrical Considerations......................................................................101