Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package Datasheet

Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet 55
Package Mechanical Specifications
4.2 Processor Insertion Specifications
The Celeron processor on 0.13 micron process can be inserted and removed 15 times from a
mPGA478B socket meeting the Intel
£
Pentium
£
4 Processor 478-pin Socket (mPGA478B) Design
Guidelines document.
4.3 Processor Mass Specifications
Table 32 specifies the processor’s mass. This includes all components that make up the entire
processor product.
4.4 Processor Materials
The Celeron processor on 0.13 micron process is assembled from several components. The basic
material properties are described in Table 33.
4.5 Processor Markings
Figure 32 details the processor top-side markings and is provided to aid in the identification of the
Celeron processor on 0.13 micron process.
Table 32. Processor Mass
Processor Mass (grams)
Intel
®
Celeron
®
processor on 0.13 micron process 19
Table 33. Processor Material Properties
Component Material
Integrated Heat Spreader Nickel over copper
Substrate Fiber-reinforced resin
Substrate pins Gold over nickel
Figure 32. Processor Markings
2A GHZ/512/400/1.50V
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©
‘01
Frequency/Cache/Bus/Voltage
S - Spec/Country of Assy
FPO - Serial #
2 GHZ/128/400/1.525V
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-
NNNN
i
m
©
‘02
Frequency/Cache/Bus/Voltage
S
- Spec/Country of Assy
FPO - Serial #
SYYYY XXXXXX
CELERON®
2 - D Matrix Mark 2 - D Matrix Mark