Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

Case Temperature Reference Metrology
100 Thermal and Mechanical Design Guidelines
25. Lift the heater block and magnified lens, using tweezers quickly rotate the device
90 degrees clockwise. Using the back of the tweezers press down on the solder;
this will force out the excess solder
Figure 53. Removing Excess Solder
26. Allow the device to cool down. Blowing compressed air on the device can
accelerate the cooling time. Monitor the device IHS temperature with a handheld
meter until it drops below 50 °C before moving it to the microscope for the final
steps.