Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence
Case Temperature Reference Metrology
102 Thermal and Mechanical Design Guidelines
29. Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (
Figure 55).
Figure 55. Removing Excess Solder
Note: Take usual precautions when using open blades
30. Clean the surface of the IHS with alcohol and use compressed air to remove any
remaining contaminants.
31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (
Figure 56)
Figure 56. Filling Groove with Adhesive