Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence
Introduction
12 Thermal and Mechanical Design Guidelines
1.1.3 Document Scope
This design guide supports the following processors:
• Intel
®
Core™2 Duo desktop processors E6700, E6600, E6420, E6400, E6320, and
E6300.
• Intel
®
Core™2 Duo desktop processors E4400 and E4300
• Intel
®
Pentium
®
Dual Core Processor E2160 and E2140
• Intel
®
Pentium
®
4 Processor 631, 641, 651, and 661 at 65 W
Note: References
to Intel
®
Core™2 Duo desktop processor with 4 MB cache apply to the
E6700 E6600, E6420, and E6320 only and references to the Intel
®
Core™2 Duo desktop
processor with 2 MB cache apply to the E6400, E6300, E4400, and E4300 only
Note: References to the Intel
®
Core™2 Duo desktop processor E6000 sequence applies to
the Intel
®
Core™2 Duo desktop processors E6700, E6600, E6420, E6400, E6320, and
E6300.
Note: References to the Intel
®
Core™2 Duo desktop processor E4000 sequence applies to
the Intel
®
Core™2 Duo desktop processor E4400 and E4300.
Note: References to the Intel
®
Pentium
®
Dual Core Processor E2000 sequence applies to the
Intel
®
Pentium
®
Dual Core Processor E2160 and E2140.
Note: References to the Intel
®
Pentium
®
4 Processor 6x1 Sequence apply to the Intel
®
Pentium
®
4 Processor 631, 641, 651, and 661.
In this document when a reference is made to “the processor” it is intended that this
includes all the processors supported by this document. If needed for clarity, the
specific processor will be listed.
In this document, when a reference is made to “the datasheet”, the reader should
refer to the Intel
®
Core™2 Duo Extreme Processor X6800 and Intel
®
Core™2 Duo
Desktop Processor E6000 and E4000 Sequence Datasheet, Intel
®
Pentium
®
Dual Core
Processor E2000 Sequence Datasheet, and Intel
®
Pentium
®
4 Processor 6x1 Sequence
Datasheet.
Chapter
2 of this document discusses package thermal mechanical requirements to
design a thermal solution for the Intel
®
Core™2 Duo desktop processor E6000/E4000
sequence and Intel
®
Pentium
®
4 processor 6x1 sequence in the context of personal
computer applications. Chapter
3 discusses the thermal solution considerations and
metrology recommendations to validate a processor thermal solution. Chapter
4
addresses the benefits of the processor’s integrated thermal management logic for
thermal design.
Chapter
6 provides information on the Intel reference thermal solution for the
processor. Chapter 6 discusses the implementation of acoustic fan speed control.
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.