Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence
Introduction
Thermal and Mechanical Design Guidelines 13
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Comment
LGA775 Socket Mechanical Design Guide http://developer.intel.com/des
ign/Pentium4/guides/302666.
htm
Intel
®
Core™2 Extreme Processor X6800 and Intel
®
Core™2 Duo
Desktop Processor E6000 and E4000 Sequence Datasheet
www.intel.com/design/proce
ssor/datashts/313278.htm
Intel
®
Pentium
®
Dual Core Processor E2000 Sequence Datasheet www.intel.com//design/proces
sor/datashts/316981.htm
Intel
®
Pentium
®
4 Processor 6x1 Sequence Datasheet www.intel.com/design/proce
ssor/datashts/310308.htm
Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775-
Land LGA Package Thermal and Mechanical Design
Guidelines
http://developer.intel.com/des
ign/Pentium4/guides/302553.
htm
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
Performance ATX Desktop System Thermal Design
Suggestions
http://www.formfactors.org/
Performance microATX Desktop System Thermal Design
Suggestions
http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan
inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the
topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
Note: Heat source must be specified for
Ψ measurements.