Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

Introduction
14 Thermal and Mechanical Design Guidelines
Term Description
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
C
– T
S
) / Total Package
Power.
Note: Heat source must be specified for
Ψ measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
A
) / Total Package Power.
Note: Heat source must be specified for
Ψ measurements.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
P
MAX
The maximum power dissipated by a semiconductor component.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS
Integrated Heat Spreader: a thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
LGA775 Socket
The surface mount socket designed to accept the processors in the 775–
Land LGA package.
ACPI
Advanced Configuration and Power Interface.
Bypass
Bypass is the area between a passive heatsink and any object that can act
to form a duct. For this example, it can be expressed as a dimension away
from the outside dimension of the fins to the nearest surface.
Thermal
Monitor
A feature on the processor that attempts to keep the processor die
temperature within factory specifications.
TCC
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die
temperature by lowering effective processor frequency when the die
temperature has exceeded its operating limits.
T
DIODE
Temperature reported from the on-die thermal diode.
FSC
Fan Speed Control: Thermal solution that includes a variable fan speed
which is driven by a PWM signal and uses the on-die thermal diode as a
reference to change the duty cycle of the PWM signal.
T
CONTROL
T
CONTROL
is the specification limit for use with the on-die thermal diode.
PWM
Pulse width modulation is a method of controlling a variable speed fan. The
enabled 4 wire fans use the PWM duty cycle % from the fan speed
controller to modulate the fan speed.
Health Monitor
Component
Any standalone or integrated component that is capable of reading the
processor temperature and providing the PWM signal to the 4 pin fan
header.
BTX Balanced Technology Extended.
TMA
Thermal Module Assembly. The heatsink, fan and duct assembly for the
BTX thermal solution
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