Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 19
Figure 2. Processor Case Temperature Measurement Location
37.5 mm
Measure T
C
at this point
(geo metric center o f the package)
37.5 mm
37.5 mm
Measure T
C
at this point
(geo metric center o f the package)
37.5 mm
2.2.2 Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. The TDP and Maximum Case Temperature are defined as the
maximum values of the thermal profile. By design the thermal solutions must meet
the thermal profile for all system operating conditions and processor power levels.
The slope of the thermal profile was established assuming a generational
improvement in thermal solution performance of the Intel reference design. For an
example of Intel
®
Core
™
2 Duo processor with 4MB cache in ATX platform, its
improvement is about 16% over the Intel reference design (RCBFH-3). This
performance is expressed as the slope on the thermal profile and can be thought of as
the thermal resistance of the heatsink attached to the processor, Ψ
CA
(Refer to
Section
3.1). The intercept on the thermal profile assumes a maximum ambient
operating condition that is consistent with the available chassis solutions.
The thermal profiles for the processor are defined such that a single thermal solution
(e.g., RCBFH-3 or BTX TMA Type II reference design) can be used for all
775_VR_CONFIG_06 processors (TDP = 65 W). See the document of Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical
Design Guidelines for the further information of RCBFH-3. See Chapter 5 for a
discussion of the BTX TMA Type II reference design.
To determine compliance to the thermal profile, a measurement of the actual
processor power dissipation is required. The measured power is plotted on the
Thermal Profile to determine the maximum case temperature. Using the example in
Figure 3 for a processor dissipating 50W the maximum case temperature is 58 °C. See
the datasheet for the thermal profile.