Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

Processor Thermal/Mechanical Information
24 Thermal and Mechanical Design Guidelines
2.4 System Thermal Solution Considerations
2.4.1 Chassis Thermal Design Capabilities
The Intel reference thermal solutions and Intel
®
Boxed Processor thermal solutions
assume that the chassis delivers a maximum T
A
at the inlet of the processor fan
heatsink (refer to Section
6.1.1). The tables below show the T
A
requirements for the
reference solutions and Intel Boxed processor thermal solutions.
Table 1. Heatsink Inlet Temperature of Intel
®
Reference Themal Solutions
Processor Type ATX RCBFH-3 BTX Type II
Heatsink Inlet Temperature 40 °C 35.5 °C
Table 2. Heatsink Inlet Temperature of Intel
®
Boxed Processor Themal Solutions
Processor Type Boxed Processor for Intel
®
Core™2 Duo Processor
E6000 and E4000 Sequence, Intel
®
Pentium
®
Dual
Core Processor E2000 Sequence, and Intel
®
Pentium
®
4 Processor 6x1 Sequence
Heatsink Inlet Temperature 38 °C
NOTE:
1. Boxed processor thermal solutions for ATX assume the use of the thermally advantaged
chassis.
2. Refer to Thermally Advantaged Chassis, version 1.1 for Thermally Advantaged Chassis
thermal and mechanical requirements.
2.4.2 Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system
components. Moving air through the chassis brings in air from the external ambient
environment and transports the heat generated by the processor and other system
components out of the system. The number, size and relative position of fans and
vents determine the chassis thermal performance, and the resulting ambient
temperature around the processor. The size and type (passive or active) of the
thermal solution and the amount of system airflow can be traded off against each
other to meet specific system design constraints. Additional constraints are board
layout, spacing, component placement, acoustic requirements and structural
considerations that limit the thermal solution size. For more information, refer to the
Performance ATX Desktop System Thermal Design Suggestions or Performance
microATX Desktop System Thermal Design Suggestions or Balanced Technology
Extended (BTX) System Design Guide documents available on the
http://www.formfactors.org/
web site.
In addition to passive heatsinks, fan heatsinks and system fans are other solutions
that exist for cooling integrated circuit devices. For example, ducted blowers, heat
pipes and liquid cooling are all capable of dissipating additional heat. Due to their
varying attributes, each of these solutions may be appropriate for a particular system
implementation.