Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

Thermal and Mechanical Design Guidelines 5
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with
Intel
®
Reference Design........................................................................71
A.2.1 Heatsink Preload Requirement Limitations...................................71
A.2.2 Motherboard Deflection Metric Definition.....................................72
A.2.3 Board Deflection Limits ............................................................73
A.2.4 Board Deflection Metric Implementation Example.........................74
A.2.5 Additional Considerations .........................................................75
A.3 Heatsink Selection Guidelines.................................................................76
Appendix B Heatsink Clip Load Metrology............................................................................77
B.1 Overview ............................................................................................77
B.2 Test Preparation...................................................................................77
B.2.1 Heatsink Preparation................................................................77
B.2.2 Typical Test Equipment ............................................................80
B.3 Test Procedure Examples.......................................................................80
B.3.1 Time-Zero, Room Temperature Preload Measurement...................81
B.3.2 Preload Degradation under Bake Conditions ................................81
Appendix C Thermal Interface Management.........................................................................83
C.1 Bond Line Management.........................................................................83
C.2 Interface Material Area..........................................................................83
C.3 Interface Material Performance...............................................................83
Appendix D Case Temperature Reference Metrology..............................................................85
D.1 Objective and Scope.............................................................................85
D.2 Supporting Test Equipment....................................................................86
D.3 Thermal calibration and controls.............................................................87
D.4 IHS Groove .........................................................................................87
D.5 Thermocouple Attach Procedure .............................................................91
D.5.1 Thermocouple Conditioning and Preparation................................91
D.5.2 Thermocouple Attachment to the IHS.........................................92
D.5.3 Solder Process........................................................................97
D.5.4 Cleaning & Completion of Thermocouple Installation...................101
D.6 Thermocouple Wire Management..........................................................104
Appendix E Legacy Fan Speed Control..............................................................................107
E.1 Thermal Solution Design .....................................................................107
E.1.1 Determine Thermistor Set Points .............................................107
E.1.2 Minimum Fan Speed Set Point................................................. 108
E.2 Board and System Implementation .......................................................109
E.2.1 Choosing Fan Speed Control Settings.......................................109
E.3 Combining Thermistor and Digital Thermal Sensor Control .......................113
E.4 Interaction of Thermal Profile and T
CONTROL
.............................................113
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations..................119
Appendix G Mechanical Drawings.....................................................................................123
Appendix H Intel
®
Currently Enabled Reference Solution Information ....................................140