Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines 53
6 ATX Thermal/Mechanical
Design Information
6.1 ATX Reference Design Requirements
Intel is not developing an ATX reference thermal solution for the Intel
®
Core™2 Duo
desktop processor E6000/E4000 sequence, Intel
®
Pentium
®
Dual Core processor
E2000 sequence, and Intel
®
Pentium
®
4 processor 6x1 sequence with a TDP of 65 W.
This chapter will document the requirements for an active air-cooled design, with a
fan installed at the top of the heatsink. The thermal technology required for the
775_VR_CONFIG_06 processor is roughly equivalent to RCBFH-3, see Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775–Land LGA Package Thermal and Mechanical
Design Guidelines for a complete description of this reference design
Note: Intel ATX reference design RCBFH-3 is the higher thermal solution performance of the
65 W 775_VR_CONFIG_06 requirements (It requires Ψ
CA
. of 0.04 °C/W lower than the
65 W 775_VR_CONFIG_06 requirements). It generates an improvement in acoustic
performance to reduce the fan speed to show the acoustic advantage (acoustic results
are in Table 9).
Note: If the heatsink design is used in your product for cost savings instead of acoustic
advantage, the design that optimizes cost would likely use aluminum core type
designs with the similar fan or a combination of all these (the smaller copper core, the
less expensive fan, and the lower fin density extrusion).
The ATX motherboard keep-out and height recommendations defined Section 6.5
remain the same for a thermal solution for the Intel
®
Core™2 Duo desktop processor
E6000/E4000 sequence and Intel
®
Pentium
®
Dual Core processor E2000 sequence
with a TDP of 65 W. The solution should come as an integrated assembly. An example
of an exploded view of the assembly is provided
Figure 19.
Note: The 65 W 775_VR_CONFIG_06 mechanical requirements would need to meet all the
published mechanical requirements for 2005 Performance 775_VR_CONFIG_05
solutions (RCFH-4); such as, the mechanical keep-in, keep-out, symmetry and socket
loading.
Note: If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection
(e.g., protection barriers, a cage, or an interlock) against contact with the energized
fan by the user during user servicing.
6.1.1 Target Heatsink Performance
Table 8 provides the target heatsink performance for the 775_VR_CONFIG_06 65 W
processors with ATX boundary conditions. The results are based on the test procedure
described in Section 6.1.4.
The table also includes a T
A
assumption of 40 °C for the Intel reference thermal
solution at the processor fan heatsink inlet discussed Section
3.3. An external ambient
temperature to the chassis of 35 °C is assumed, resulting in a temperature rise, T
R
, of
5 °C. Meeting T
A
and Ψ
CA
targets can maximize processor performance (refer to
Sections
2.2, 2.4. and Chapter 4). Minimizing T
R
can lead to improved acoustics.