Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

6 Thermal and Mechanical Design Guidelines
Figures
Figure 1. Package IHS Load Areas .....................................................................15
Figure 2. Processor Case Temperature Measurement Location ...............................19
Figure 3. Example Thermal Profile .....................................................................20
Figure 4. Processor Thermal Characterization Parameter Relationships....................28
Figure 5. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink..31
Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......32
Figure 7. Concept for Clocks under Thermal Monitor Control..................................35
Figure 8. Thermal Monitor 2 Frequency and Voltage Ordering................................36
Figure 9. TCONTROL for Digital Thermal Sensor ..................................................39
Figure 10. Effective TMA Fan Curves with Reference Extrusion...............................44
Figure 11. Random Vibration PSD......................................................................46
Figure 12. Shock Acceleration Curve..................................................................47
Figure 13. Intel Type II TMA 65W Reference Design.............................................49
Figure 14. Upward Board Deflection During Shock ...............................................50
Figure 15. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness ........................................................................................
51
Figure 16. Thermal Module Attach Pointes and Duct-to-SRM Interface Features........52
Figure 17. Random Vibration PSD......................................................................57
Figure 18. Shock Acceleration Curve..................................................................57
Figure 19. Intel
®
RCFH-4 Reference Design – Exploded View.................................61
Figure 20. Upward Board Deflection During Shock ...............................................62
Figure 21. Reference Clip/Heatsink Assembly......................................................63
Figure 22. Critical Parameters for Interfacing to Reference Clip..............................64
Figure 23. Critical Core Dimension.....................................................................64
Figure 24. Intel
®
QST Overview ........................................................................66
Figure 25. PID Controller Fundamentals .............................................................67
Figure 26. Intel
®
QST Platform Requirements......................................................68
Figure 27. Example Acoustic Fan Speed Control Implementation............................69
Figure 28. Digital Thermal Sensor and Thermistor................................................70
Figure 29. Board Deflection Definition................................................................73
Figure 30. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........75
Figure 31. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ...78
Figure 32. Load Cell Installation in Machined Heatsink Base Pocket – Side View .......79
Figure 33. Preload Test Configuration.................................................................79
Figure 34. Omega Thermocouple.......................................................................87
Figure 35. 775-LAND LGA Package Reference Groove Drawing...............................88
Figure 36. 775-LAND LGA Package Reference Groove Drawing Alternate Orientation.89
Figure 37. IHS Groove per Figure 35 on the 775-LAND LGA Package ......................90
Figure 38. IHS Groove per Figure 35 Orientation Relative to the LGA775 Socket ......90
Figure 39. Inspection of Insulation on Thermocouple............................................91
Figure 40. Bending the Tip of the Thermocouple..................................................92
Figure 41. Securing Thermocouple Wires with Kapton* Tape Prior to Attach ............92
Figure 42. Thermocouple Bead Placement...........................................................93
Figure 43. Position Bead on the Groove Step.......................................................94
Figure 44. Detailed Thermocouple Bead Placement ..............................................94
Figure 45. Third Tape Installation......................................................................95
Figure 46. Measuring Resistance between Thermocouple and IHS ..........................95
Figure 47. Applying Flux to the Thermocouple Bead .............................................96
Figure 48. Cutting Solder .................................................................................96
Figure 49. Positioning Solder on IHS..................................................................97
Figure 50. Solder Station Setup ........................................................................98
Figure 51. View Through Lens at Solder Station...................................................99