Intel Core2 Duo Desktop Processor, Intel Pentium Processor, and Intel Pentium 4 Processor 6x1 Sequence

Thermal and Mechanical Design Guidelines 7
Figure 52. Moving Solder back onto Thermocouple Bead.......................................99
Figure 53. Removing Excess Solder .................................................................100
Figure 54. Thermocouple placed into groove .....................................................101
Figure 55. Removing Excess Solder .................................................................102
Figure 56. Filling Groove with Adhesive............................................................102
Figure 57. Application of Accelerant.................................................................103
Figure 58. Removing Excess Adhesive from IHS ................................................103
Figure 59. Finished Thermocouple Installation...................................................104
Figure 60. Thermocouple Wire Management...................................................... 105
Figure 61. Thermistor Set Points .....................................................................108
Figure 62. Example Fan Speed Control Implementation ...................................... 109
Figure 63. Fan Speed Control..........................................................................110
Figure 64. Temperature Range = 5 °C .............................................................111
Figure 65. Temperature Range = 10 °C............................................................112
Figure 66. On-Die Thermal Sensor and Thermistor.............................................113
Figure 67. FSC Definition Example...................................................................115
Figure 68. System Airflow Illustration with System Monitor Point Area Identified.... 120
Figure 69. Thermal sensor Location Illustration .................................................121
Figure 70. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components – Sheet 1 ................................
124
Figure 71. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components – Sheet 2 .................................
125
Figure 72. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components – Sheet 3 .................................
126
Figure 73. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 1......................................................................
127
Figure 74. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 2......................................................................
128
Figure 75. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 3......................................................................
129
Figure 76. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 4......................................................................
130
Figure 77. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 5......................................................................
131
Figure 78. ATX Reference Clip – Sheet 1...........................................................132
Figure 79. ATX Reference Clip – Sheet 2...........................................................133
Figure 80. Reference Fastener – Sheet 1 ..........................................................134
Figure 81. Reference Fastener – Sheet 2 ..........................................................135
Figure 82. Reference Fastener – Sheet 3 ..........................................................136
Figure 83. Reference Fastener – Sheet 4 ..........................................................137
Figure 84. Intel
®
RCFH4 Reference Solution Assembly........................................138
Figure 85. Intel
®
RCFH4 Reference Solution Assembly – Sheet 2..........................139