Note

Application Note 7
1 Introduction
The Intel
®
Socket Test Technology for the LGA771 socket is a test chip that enables testing for the
mechanical integrity and electrical continuity of both socket-to-board solder ball connectivity and
socket-to-CPU contact connectivity. Once inserted into the board’s LGA771 socket, the test chip
works with either in-circuit testers (ICT) or manufacturing defect analyzers (MDA) that have
access to all the socket nets through test fixture probes.
An ICT uses digital test vectors which execute very quickly when power is applied to the board—
typically less than a couple of milliseconds depending upon test head capability. An MDA doesn’t
power the board, but uses its analog measurement capability. Test time using an MDA is typically
longer.
Figure 1-1. Intel® Socket Test Technology for the LGA771 Socket-Test Chip JM8FKZLVA