Guide

12 Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide
Design Guidelines
2.1.2 Motherboard Volumetric Constraint Requirements
The volumetric constraint zone reserved for the processor package, heatsink, and heatsink
attachment method for the baseboard is shown in Figure 3, Figure 4 and Figure 5. These are the
typical volumetric constraint zones for the FC-mPGA4 package and mPGA478B socket in the
ATX form factor. Figure 6 and Figure 7 show the primary and secondary side volumetric constraint
for the 1U and 2U reference thermal solutions.