Guide

Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide 21
Design Guidelines
In addition, the thermal solution must apply sufficient pressure on the IHS to:
• Maintain desired pressure on the TIM for thermal performance.
• Ensure that the package does not disengage from the socket during mechanical shock and
vibration events (also known as package pullout).
• Protect solder joints from surface mount component damage during mechanical shock events
if no other motherboard stiffening device is used.