Guide

30 Intel
®
Celeron
®
D Processor for Embedded Applications Thermal Design Guide
Thermal Design Guidelines
4.5 Recommended Thermal Solutions
4.5.1 Desktop/ATX Form Factor
The Intel Embedded IA division (EID) is enabling the following active thermal solutions for the
Intel Celeron D Processor in the ATX form factor:
This is the standard thermal solution enabled by Intel’s Reseller’s Products Group. It has been
tested in environments with a T
LA
up to 40° C. However, system-level verification should be
performed in its intended use.
4.5.2 1U Reference Thermal Solution
Intel has designed a reference thermal solution for the Intel Celeron D Processor in the 1U form
factor. This solution uses dense fin heat sink technology combined with high speed airflow devices.
This thermal solution has a relatively high pressure drop and requires an airflow source that can
provide the necessary amount of airflow to meet the component and system thermal performance
targets. The performance for this heatsink when used in combination with a high speed blower and
Shin-Etsu* G751 thermal grease, has shown a
Ψ
CA
= 0.33° C/W at 15.5 CFM and 0.60 in_water.
However, the final intended thermal solution including, heatsink, TIM and attach mechanism must
be validated by system integrators. In addition to the high speed airflow source, this heatsink
Figure 11. Thermal Resistance Values for Various Operating Temperatures
Table 4. Recommended Thermal Solutions
Heatsink Manufacturer Intel Part Number
Sanyo-Denki C33218